Principal Packaging Architect
2 months ago
At ARM, we are seeking a highly skilled Principal Packaging Architect to join our System Integration team. As a key member of our team, you will work closely with various departments, including IP, SoC Design, Package Design, Signal Integrity, Power Integrity, Thermal, Thermomechanical Test, and Systems teams, to develop innovative packaging solutions that meet the evolving needs of our customers.
You will play a critical role in identifying and implementing cutting-edge packaging technologies, establishing strategic partnerships, and collaborating with internal and external stakeholders to address complex challenges in areas such as 2.5D/3DIC and sub-3nm nodes. The ideal candidate will possess a strong passion for engineering and a deep understanding of package design, assembly yield analysis, die-to-die interfaces, and manufacturing technologies.
Key Responsibilities:- Pathfinding and Optimization: Conduct pathfinding activities with new programs to optimize the system-level solution space and identify opportunities for innovation.
- Technology Identification and Implementation: Identify and implement innovative technologies that maximize the performance of ARM architectures and drive the development of advanced packaging solutions.
- Collaboration and Partnership: Work closely with internal and external customer partners on silicon-disaggregation and other chiplet strategies for advanced packages, including emerging-memory chiplet integration.
- Packaging Roadmap and Strategy: Identify critical elements for ARM's packaging roadmap and disseminate these use strategies to key partners.
- Design Strategy and Manufacturing: Drive design strategies for performance and manufacturability in packaging and work closely with external partners to drive successful assembly prototypes.
- Package Failure Mechanisms and Causes: Strong understanding of package failure mechanisms and causes.
- Package Standards and Methodologies: Expertise in package standards, 2.xD, 3D, and other chiplet packaging methodologies.
- Signal Integrity, Power Integrity, Thermal, and Thermomechanical Principles: Knowledge of signal integrity, power integrity, thermal, and thermomechanical principles.
- Memory Interfaces: Depth of knowledge in memory interfaces such as HBM3, GDDR6, etc.
- Package Engineering Experience: Minimum 12 years of experience in package engineering, including advanced multichip system-in-package work.
- Interpersonal Skills and Collaboration: Excellent interpersonal skills, strong initiative, and ability to engage and learn new concepts and share with collaborators.
- Education and Qualifications: Bachelors, Masters, or Ph.D. degree or equivalent experience in Electrical Engineering or Mechanical Engineering.
ARM offers a competitive salary range of $230,265 to $311,535, which is only one component of our total reward package. We value our employees as individuals and strive to provide a fair and equitable compensation package that reflects their skills, experience, and contributions to the company.
Our Culture and Values:We are proud to have a set of behaviors that reflect our culture and guide our decisions, defining how we work together to defy ordinary and shape outstanding results. Our values include:
- Partner and Customer Focus: We prioritize our customers' needs and work closely with them to deliver innovative solutions.
- Teamwork and Communication: We foster a collaborative environment where team members can share ideas, learn from each other, and work together to achieve common goals.
- Creativity and Innovation: We encourage creativity and innovation, and we recognize and reward individuals who bring new ideas and approaches to the table.
- Team and Personal Development: We invest in our employees' growth and development, providing opportunities for training, mentorship, and career advancement.
- Impact and Influence: We strive to make a positive impact on our customers, our industry, and our community, and we recognize and reward individuals who demonstrate leadership and influence.
- Deliver on Your Promises: We value integrity and reliability, and we expect our employees to deliver on their commitments and maintain the highest standards of professionalism.
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