High-Performance Memory Design Engineer

4 days ago


Atlanta, Georgia, United States Micron Full time

About the Role:

We are seeking an experienced Principal Design Engineer to join our HBM Engineering team, focusing on high-bandwidth memory design. The ideal candidate will have a strong background in memory array architectures, high-speed interface design, and custom circuit design.

Key Responsibilities:

  • Collaborate with the architecture team and external customers on new product specifications.
  • Pathfinding to explore new system-level solutions for future HBM products.
  • Drive interface logic chip and memory architecture solutions.
  • Develop circuit designs for the memory array, input buffer, output buffer, control logic, address decode, datapath, internal test logic, power generators, and PLL.

Requirements:

  • MSEE or greater.
  • 10+ years of relevant job/skill-related experience.
  • Experience delivering highly technical solutions.
  • In-depth technical expertise in one or more areas - DRAM memory array design, high-speed clocking and interface development, analog circuit design, digital/logic and custom circuit design, power delivery optimization, CMOS & semiconductor device physics, and 3D packaging technologies.


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