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High-Performance Memory Design Engineer
1 month ago
About the Role:
We are seeking an experienced Principal Design Engineer to join our HBM Engineering team, focusing on high-bandwidth memory design. The ideal candidate will have a strong background in memory array architectures, high-speed interface design, and custom circuit design.
Key Responsibilities:
- Collaborate with the architecture team and external customers on new product specifications.
- Pathfinding to explore new system-level solutions for future HBM products.
- Drive interface logic chip and memory architecture solutions.
- Develop circuit designs for the memory array, input buffer, output buffer, control logic, address decode, datapath, internal test logic, power generators, and PLL.
Requirements:
- MSEE or greater.
- 10+ years of relevant job/skill-related experience.
- Experience delivering highly technical solutions.
- In-depth technical expertise in one or more areas - DRAM memory array design, high-speed clocking and interface development, analog circuit design, digital/logic and custom circuit design, power delivery optimization, CMOS & semiconductor device physics, and 3D packaging technologies.