Principal Package Design Engineer
1 week ago
We are seeking a highly skilled Principal Package Design Engineer to lead the design and development of innovative packaging solutions for our products.
Key Responsibilities:- Design, develop, and fabricate BCD, GaN, and discrete MOS semiconductor devices.
- Conduct TCAD simulations and modeling to predict device performance and identify novel device concepts.
- Collaborate with cross-functional teams to ensure device designs meet specifications and performance targets.
- Perform device characterization and analysis using advanced measurement techniques and equipment.
- Troubleshoot and resolve issues related to power device performance, reliability, and manufacturing processes.
- Stay up-to-date with the latest advancements in semiconductor technology and industry trends.
- M.S. or Ph.D. degree in Electrical Engineering, Materials Science, Physics, or a related field.
- Strong understanding of semiconductor physics and device operation, with particular emphasis on LDMOS and GaN power devices.
- Experience with semiconductor device design, simulation, and characterization tools.
- Proficiency in data analysis and statistical tools.
- Excellent problem-solving skills and attention to detail.
- Strong communication and teamwork abilities.
- Experience working with foundries and internal development teams.
Renesas Electronics is an embedded semiconductor solution provider driven by its purpose 'To Make Our Lives Easier.' As the industry's leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
We remain agile and fearless as we accelerate our growth, encouraging everyone to play an active role with an entrepreneurial mindset and accountability.
At Renesas, you can launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.
Make a real impact by developing automotive, industrial, infrastructure, IoT, and sustainable products and solutions to meet our customers' evolving needs and help people and communities thrive tomorrow.
Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from Day 1.
We are an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law.
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Principal Package Design Engineer
1 week ago
Chandler, Arizona, United States Renesas Full timeJob DescriptionAs a Principal Package Design Engineer at Renesas, you will lead the design and development of cutting-edge packaging solutions for our semiconductor products.Key Responsibilities:Design, develop, and fabricate BCD, GaN, and discrete MOS semiconductor devices.Conduct TCAD simulations and modeling to predict device performance and identify...
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