Principal Package Design Engineer

1 week ago


Chandler, Arizona, United States Renesas Full time
Job Description

As a Principal Package Design Engineer at Renesas, you will lead the design and development of cutting-edge packaging solutions for our semiconductor products.

Key Responsibilities:
  • Design, develop, and fabricate BCD, GaN, and discrete MOS semiconductor devices.
  • Conduct TCAD simulations and modeling to predict device performance and identify novel device concepts.
  • Collaborate with cross-functional teams to ensure device designs meet specifications and performance targets.
  • Perform device characterization and analysis using advanced measurement techniques and equipment.
  • Troubleshoot and resolve issues related to power device performance, reliability, and manufacturing processes.
Requirements:
  • M.S. or Ph.D. degree in Electrical Engineering, Materials Science, Physics, or a related field.
  • Strong understanding of semiconductor physics and device operation, with particular emphasis on LDMOS and GaN power devices.
  • Experience with semiconductor device design, simulation, and characterization tools.
  • Proficiency in data analysis and statistical tools.
  • Excellent problem-solving skills and attention to detail.
  • Strong communication and teamwork abilities.
About Renesas

Renesas is an embedded semiconductor solution provider driven by its purpose 'To Make Our Lives Easier.' As the industry's leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions based on the broadest product portfolio.

We are a diverse team of over 21,000 professionals in more than 30 countries, committed to expanding our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation.

We remain agile and fearless as we accelerate our growth, encouraging everyone to play an active role with an entrepreneurial mindset and accountability.



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