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IC Packaging Characterization Engineer
2 months ago
We are seeking a highly skilled IC Packaging Characterization Engineer to join our team at Apple. As a key member of our Packaging team, you will be responsible for the characterization of Integrated Circuits (IC) packages and related materials.
Key Responsibilities- Characterize component packages under various environmental and reliability testing conditions, such as mechanical loading, thermal and moisture stressing.
- Characterize key packaging materials and supervise material characterization activities at suppliers.
- Develop characterization methodologies for IC packages and related materials, including setting up equipment and building proper fixtures for the test.
- Work on trouble-shooting activities of packaging-related failures.
- Proficiency with major mechanical design CAD tools, such as Siemens NX, AutoCAD, SpaceClaim, SolidWorks, etc.
- Proven capability of setting up equipment and data acquisition systems.
- Hands-on experience of major material analysis and failure analysis tools (e.g., SEM, EDX, FIB, CSAM, etc.) is helpful.
- Knowledge of the Integrated Circuit packaging process, reliability, qualification requirements, and key materials is a plus.
- Excellent written and verbal communication skills with ability to present ideas, data, and plans with high confidence at team meetings.
- BS and 3+ years of relevant industry experience.
- Base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role.
- Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs.
- Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses.
