Electronics Packaging Design Engineer

5 days ago


Baltimore, Maryland, United States Northrop Grumman Full time

Northrop Grumman is seeking an Electronics Packaging Design Engineer to join our team of talented professionals in Linthicum, Maryland.

About the Job

This position will involve working as part of a cross-functional team responsible for designing and developing cutting-edge AESA antenna hardware featured in Northrop Grumman's world-class radar, ESM, and communications systems. You will support multiple projects spanning the product lifecycle from R&D to full-rate production.

Your key responsibilities will include design, prototyping, and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies.

Required Skills and Qualifications
  • Bachelor's degree with 5 years of experience, a Master's degree with 3 years of experience or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
  • U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance.
  • Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate/PWB layout.
  • Working knowledge of materials, specifications, manufacturing processes, and design tools utilized for multi-chip modules, PWBs, and CCAs.
  • Proficient with AutoCAD.
  • Familiarity with NX or other 3D modeling software.


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