IC Package Design Engineer

4 weeks ago


Santa Clara, California, United States Apple Full time
Job Description

At Apple, we're looking for a skilled IC Package Design Engineer to join our Hardware Technology Packaging team. As a key member of our team, you'll be responsible for inventing, designing, developing, and integrating electronic packaging solutions for our consumer electronic products.

Key Responsibilities:

  • Own and drive sophisticated package selection, new generation product package structure, and configuration optimization.
  • Implement the physical design of packages and modules for SoC, Memory, RF, and cellular chips.
  • Interface and coordinate with multi-functional groups throughout Apple on new product package/SiP/module feasibility analysis, design, and selection.
  • Define and develop design verification and automation strategy to strengthen and streamline package design as well as release flows.
  • Work multi-functionally to optimize package pin out.
  • Perform extraction of S-parameters and package RLGC model.
  • Ensure package design is optimized with SI/PI requirements.
  • Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.
  • Explore, evaluate, and develop new CAD tool, design, and verification flow.
  • Partner with Silicon PD team to optimize chip Floorplan and bump placement, and minimize package size.

Requirements:

  • BS and 10+ years of relevant industry experience.
  • Proven fundamentals in the electrical/material/thermal/or mechanical engineering field(s).
  • Familiarity with various sophisticated package configurations and assembly/substrate technology (wirebond, POP, etc.).
  • Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
  • Basic understanding in some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters, and RLGC model.
  • Basic knowledge of substrate manufacturing process, structure, design rules, and material property.
  • Proven understanding of high-speed interfaces, including DDR, PCIe, NAND, etc.
  • Exposure to Unix environment, scripting languages (PERL, Python, TCL, and/or shell) and methodology.

Preferred Skills:

  • Familiarity with CAM350/Valor or Calibre and CAD and experience with package design reviews.
  • Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance).
  • Design experience with RFIC and 5G packages, SIP or module schematic and layout design experience.
  • Solid understanding of Design Rules Check and Design for Manufacturing.


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