IC Package Design Engineer
4 weeks ago
At Apple, we're looking for a skilled IC Package Design Engineer to join our Hardware Technology Packaging team. As a key member of our team, you'll be responsible for inventing, designing, developing, and integrating electronic packaging solutions for our consumer electronic products.
Key Responsibilities:
- Own and drive sophisticated package selection, new generation product package structure, and configuration optimization.
- Implement the physical design of packages and modules for SoC, Memory, RF, and cellular chips.
- Interface and coordinate with multi-functional groups throughout Apple on new product package/SiP/module feasibility analysis, design, and selection.
- Define and develop design verification and automation strategy to strengthen and streamline package design as well as release flows.
- Work multi-functionally to optimize package pin out.
- Perform extraction of S-parameters and package RLGC model.
- Ensure package design is optimized with SI/PI requirements.
- Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.
- Explore, evaluate, and develop new CAD tool, design, and verification flow.
- Partner with Silicon PD team to optimize chip Floorplan and bump placement, and minimize package size.
Requirements:
- BS and 10+ years of relevant industry experience.
- Proven fundamentals in the electrical/material/thermal/or mechanical engineering field(s).
- Familiarity with various sophisticated package configurations and assembly/substrate technology (wirebond, POP, etc.).
- Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
- Basic understanding in some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters, and RLGC model.
- Basic knowledge of substrate manufacturing process, structure, design rules, and material property.
- Proven understanding of high-speed interfaces, including DDR, PCIe, NAND, etc.
- Exposure to Unix environment, scripting languages (PERL, Python, TCL, and/or shell) and methodology.
Preferred Skills:
- Familiarity with CAM350/Valor or Calibre and CAD and experience with package design reviews.
- Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance).
- Design experience with RFIC and 5G packages, SIP or module schematic and layout design experience.
- Solid understanding of Design Rules Check and Design for Manufacturing.
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