Principal Thermal Engineer

As a Principal Thermal Engineer at Oracle, you will play a critical role in aligning thermal hardware design with data center physical infrastructure. This position requires a mix of technical breadth and depth to work cross-functionally with various disciplines, including Mechanical, Electrical, Thermal, and Software, to develop thermal solutions optimized for the entire stack.

You will work with internal and external partners to deliver the next generation of world-class hardware and data centers. Your responsibilities will include:

• Building, conducting thermal simulations, and reviewing thermal simulation models from partners to identify data center risks and improve efficiency.
• Designing and conducting experiments for validating and producing accurate CFD models by comparing test results against platform telemetry and facility BMS data.
• Engaging with leading CFD software companies to drive their product roadmap to meet OCI's requirements for high-density air and liquid cooling solutions.

• Collaborating with internal and external partners across the globe to develop platform hardware and data center infrastructure solutions enabling OCI services.
• Leading thermal design reviews and presentations of concepts to peers, partner teams, and executives.
• Working jointly with multidisciplinary teams consisting of both in-house and external partners in the development of Advanced Cooling Solution (ACS) concept prototypes.
• Engaging hardware development organizations to drive concepts to the product roadmap and OCI data center fleet.
• Collaborating with multifunctional engineering groups to deliver hardware and data center sites aligned with thermal specifications.
• Collaborating with firmware and controls engineering teams to create robust thermal control and monitoring systems.
• Conducting design/debug investigations and support failure analysis and resolution activities for platforms and data center infrastructure.
• Designing and creating thermal characterization test plans. Collaborating with technicians and industry partners to complete tests. Analyzing results to validate compliance with platform and data center infrastructure specifications.
• Supporting the high-level thermal design direction and data center strategy for complex systems ranging from advanced computing (HPC, GPU, FPGA Accelerators, etc.) to general-purpose compute, storage, network, and/or other specialized programs.
• Creating robust, scalable, secure, and extensible thermal architecture solutions that account for current and anticipated industry/competitive needs.
• Distilling and articulating architectural tradeoffs in the thermal space in terms of key metrics such as feasibility, performance, cost, reliability, availability, and schedule.
• Partnering with the platform and data center architects to drive OCI roadmap definitions.
• Acquiring and sharing expert knowledge of multiple technical areas within and across teams working on similar products.
• Looking for opportunities to generate intellectual property to help strengthen OCI's position as a leader in cloud computing.
• Driving and influencing technology providers and design partners to develop optimal components and solutions to meet the future requirements of the OCI fleet.
• Partnering within the industry and standards bodies to create standards and form factors key to next-generation solutions.
• Collaborating with the hardware development and data center design and construction teams to ensure seamless transition from architecture to implementation.

• 7+ years of cloud scale provider or related technical engineering experience and a Bachelor's degree in Mechanical, Thermal Fluid Science, Systems, or Aerospace Engineering.
• OR 4+ years of related cloud scale provider or technical engineering experience and a Master's degree in Mechanical, Thermal Fluid Science, Systems, or Aerospace Engineering.
• OR 3+ years of related cloud scale provider or technical engineering experience and a Doctorate degree in Mechanical, Thermal Fluid Science, Systems, or Aerospace Engineering.
• 3+ years of experience and proficiency in Computational Fluid Dynamics (CFD) analysis.
• Expertise using Cadence Data Center Solution (aka 6SigmaDCX), CoolSim, TileFlow, AutoDesk CFD, ANSYS - Icepak, or Mentor Graphics FloTHERM.

• Experience with creating digital twins.
• Working knowledge and design ability for data center direct-to-chip liquid cooling technologies, including using liquid-to-liquid, liquid-to-air, single-phase, and two-phase cooling distribution units, cold plates, manifolds for hybrid air and liquid data center cooling.
• Experience performing data analytics and visualization using Python, SQL, Tableau, PowerBI, Oracle Analytics Cloud, or equivalent.
• Communication skills, including the ability to clearly express technical concepts in verbal and written forms.
• Experience creating high-level systems concepts, documenting, and evaluating concepts, and providing analysis to other organizations and upper management.
• Problem-solving, debug, and failure analysis skills with a solid understanding of core engineering principles and analytical techniques.
• Experience in thermal design and analysis of compute architecture is desired.
• Working knowledge of mechanical and electrical system design considerations.
• Exposure/Hands-on experience with compute-related thermal, airflow, and liquid cooling characterization and evaluation testing.
• Some travel (less than 10%) domestic/international travel required as appropriate to support design and build activities.

Disclaimer: Certain US customer or client-facing roles may be required to comply with applicable requirements, such as immunization and occupational health mandates.

Range and benefit information provided in this posting are specific to the stated locations only

US:

Hiring Range: from $97,400 to $199,500 per annum. May be eligible for bonus and equity.

Candidates are typically placed into the range based on the preceding factors as well as internal peer equity.

Oracle US offers a comprehensive benefits package which includes the following:

• Medical, dental, and vision insurance, including expert medical opinion
• Short-term disability and long-term disability
• Life insurance and AD&D
• Supplemental life insurance (Employee/Spouse/Child)
• Health care and dependent care Flexible Spending Accounts
• Pre-tax commuter and parking benefits
• 401(k) Savings and Investment Plan with company match

Paid time off: Flexible Vacation is provided to all eligible employees assigned to a salaried (non-overtime eligible) position. Accrued Vacation is provided to all other employees eligible for vacation benefits. For employees working at least 35 hours per week, the vacation accrual rate is 13 days annually for the first three years of employment and 18 days annually for subsequent years of employment. Vacation accrual is prorated for employees working between 20 and 34 hours per week. Employees working fewer than 20 hours per week are not eligible for vacation.

11 paid holidays

Paid sick leave: 72 hours of paid sick leave upon date of hire. Refreshes each calendar year. Unused balance will carry over each year up to a maximum cap of 112 hours.

Paid parental leave

Adoption assistance

Employee Stock Purchase Plan

Financial planning and group legal

Voluntary benefits including auto, homeowner, and pet insurance

The role will generally accept applications for at least three calendar days from the posting date or as long as the job remains posted.

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