Hardware Packaging Innovator

4 days ago


Santa Clara, California, United States Apple Full time

**Job Summary**

We are seeking an experienced IC Package Design Engineer to join our Hardware Technology Packaging team at Apple. The successful candidate will design and develop advanced electronic packaging solutions for our internal and custom external components of hardware for our consumer electronic products.

This role involves owning and driving sophisticated package selection, new generation product package structure and configuration optimization. You will be responsible for Package/SIP/module physical design and layout, optimization, DV and tape out; and work with multi-functional teams to achieve optimized mechanical/electrical/thermal performance for various types of chips.

The ideal candidate will have experience in package design using Cadence Allegro platform tools or Mentor Xpedition platform tools and familiarity with SI/PI tools, package model extraction, S-parameters and RLGC model.

**Key Responsibilities**

  • Develop advanced electronic packaging solutions for internal and custom external components of hardware.
  • Work with multi-functional teams to achieve optimized mechanical/electrical/thermal performance for various types of chips.


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