Thermal Engineer
2 weeks ago
We are seeking a highly motivated and experienced Thermal Engineer to join our team at Apple. As a key member of our engineering team, you will be responsible for optimizing the thermal performance of our mobile devices and participating in advanced IC packaging research and development.
Key Responsibilities:- Architect thermal solutions to address chip energy efficiency and performance scaling
- Provide thermal modeling solutions to mobile devices at silicon die and semiconductor package levels
- Optimize advanced IC design scheme/floor-planning to ensure good thermal performance
- Develop detailed and reduced-order thermal models
- Analyze simulation and measurement results to enhance product thermal management
- Integrate cooling solutions to next generation SOC architecture design
- BSEE + 10 years of industry experience
- Preferred qualifications: MSEE + 10 years of industry experience
- Extensive experience in thermal analysis and modeling of System on Chip (SoC), IC packages and mobile devices
- Knowledge of semiconductor, package, PCB or mobile device design and thermal testing
- Experience working with IC physical design parameters affecting electrical and thermal performance of packaging technologies
- Knowledge of SoC design methodology, low-power techniques and thermal analysis methods
- Knowledge of advanced packaging assembly processes along with electrical and thermal characteristics of packages
- Comprehensive medical and dental coverage
- Retirement benefits
- Range of discounted products and free services
- Reimbursement for certain educational expenses
- Discretionary bonuses or commission payments
Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.
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