Senior Physical Design Engineer

6 days ago


Sunnyvale, California, United States Google Full time

About this role:

We are seeking a highly skilled Senior Physical Design Engineer with expertise in interposer design to join our team at Google. As an interposer expert, you will be responsible for designing and developing custom silicon solutions that power our direct-to-consumer products.

What you'll do:

  1. Own interposer routing necessary for 2.5D or 3D packaging, including custom signal routing, shielding, and power/ground distribution.
  2. Connect general purpose and high speed interfaces through an interposer, considering high speed effects and signal integrity.
  3. Perform ASIC top level I/O planning and Redistribution Layer (RDL) routing.
  4. Conduct technical evaluations of interposers, advanced packaging, process nodes, IP, and provide recommendations.
  5. Collaborate with other design teams on interposer layout and specification requirements, collaterals, and milestone timelines.

Requirements:

  • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
  • 10 years of experience in ASIC physical design flows and methodologies in advanced process nodes.
  • Experience with routing through custom routing or PnR tool routing.
  • Experience with layout, physical verification, Design for Manufacturability (DFM), power, and signal integrity analysis using industry standard tools.
  • Experience with Controlled-Collapse Chip Connection (C4) bumps, micro bumps, Deep Trench Capacitor (DTC), Through-silicon via (TSV), etc.

Preferred qualifications:

  • Experience leading one or more aspects of interposer or package design.
  • Experience in extraction of design parameters, Quality of Results (QoR) metrics, and analyzing trends.
  • Knowledge of techniques for testing and debugging interposer designs, including electrical and thermal.
  • Knowledge of semiconductor device physics and transistor characteristics.
  • Understanding of thermal considerations for 3D stacked dies and interposers.

About the salary:

The estimated annual salary range for this position is $214,000-$333,000 + bonus + equity + benefits. Please note that individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Benefits and perks:

  • A competitive base salary and bonus structure.
  • Equity and stock options.
  • A comprehensive benefits package, including medical, dental, and vision insurance.
  • A generous 401(k) matching program.
  • A flexible and dynamic work environment.

Company overview:

Google is proud to be an equal opportunity workplace and is an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity, or Veteran status.



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