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Manufacturing Process Engineer
2 months ago
Position Overview:
The selected candidate will be instrumental in advancing new manufacturing capabilities for both package and board-level assembly, transitioning from prototype stages to full-scale production. The Manufacturing Engineer will engage in a variety of engineering tasks across multiple projects within the organization. This role involves independently assessing, selecting, and applying standard engineering methodologies, while exercising judgment to adapt and modify processes as necessary. The assignments will have clear objectives and expectations.
Key Responsibilities:
- Develop and implement innovative capabilities for board-level processing.
- Work on flexible board assembly utilizing cutting-edge ultra-thin flexible System on Package (SoP) technologies.
- Define, develop, and optimize equipment and processes for flip-chip thin device assembly.
- Establish manufacturing processes and guidelines for team utilization.
- Collaborate with cross-functional technical teams and clients.
Qualifications:
- Experience in manufacturing processes related to board assembly, including pick-and-place operations for Surface Mount Technology (SMT) components and die.
- Strong analytical and problem-solving abilities, with familiarity in Statistical Process Control (SPC), JMP, and similar tools.
- Proficient in the use of assembly tools, electronics, robotics, and vision systems.
- Knowledgeable in the installation, startup, application, and maintenance of capital equipment.
- Ability to collaborate effectively with colleagues.
Educational Background:
A degree or relevant experience in manufacturing or engineering fields related to rigid, flexible, or rigid-flex circuit board assemblies, automated flip-chip assembly, stencil printing, or semiconductor packaging.
Interests:
Passion for advanced packaging technologies, including Flip-Chip Bumping (FCB), System in Package (SiP), heterogeneous integration, and chiplet designs. A proactive, innovative, and energetic mindset is essential. Candidates should demonstrate a hands-on approach and the ability to manage multiple tasks efficiently. Practical experience in manufacturing, assembly, or personal projects involving electronics, electrical systems, or hardware fabrication is highly regarded.
Compensation:
Salary will be commensurate with the level of education and experience. The position may offer stock options as part of the company's growth participation. Medical benefits are included in the overall compensation package.
Career Advancement:
Opportunities for advancement across various corporate sectors are available.
Additional Information:
This position requires the ability to obtain and maintain a Department of Defense security clearance.
