Senior Package Design Engineer

3 days ago


Wilsonville, Oregon, United States Siemens Digital Industries Software Full time
Job Overview

Siemens Digital Industries Software is seeking a highly skilled and experienced individual to serve as the package design lead in our 3D IC Solutions Engineering team. The successful candidate will be responsible for driving the development of comprehensive, end-to-end workflow solutions supporting the development of advanced 2.5 and 3D System in Package (SIP) designs.

Key Responsibilities
  • Develop workflows to support physical design planning, layout, and verification of advanced 3D IC designs
  • Integrate 3D IC workflows into the 3D IC Physical Design workflow
  • Provide technical support and guidance to sales, marketing, and design service organizations
  • Collaborate with customers to develop and validate workflow solutions
Requirements
  • BS or MS in Electrical/Computer Engineering
  • 10+ years of advanced package physical design and verification experience
  • Working knowledge of Advanced Packaging IC EDA tools and design methods
  • Scripting/Programming skills in Python, Tcl, Perl, or similar languages
  • Working knowledge of IC EDA tools and design methods
Why Siemens Digital Industries Software?

We offer a dynamic and inclusive work environment, with opportunities for professional growth and development. Our team is passionate about delivering innovative solutions that transform the way people live and work. If you're a motivated and experienced professional looking for a new challenge, we encourage you to apply for this exciting opportunity.



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