Packaging Engineer

3 days ago


San Jose, California, United States InterSources Full time
Job Title: Packaging Engineer

At InterSources, we are seeking a highly skilled Packaging Engineer to join our team. As a key member of our packaging team, you will be responsible for developing and implementing packaging solutions for our semiconductor products.

Job Summary:

We are looking for a talented Packaging Engineer with a strong background in semiconductor packaging. The ideal candidate will have experience in package design, development, and qualification, as well as a deep understanding of package technologies and manufacturing processes.

Key Responsibilities:
  • Develop and implement packaging solutions for semiconductor products
  • Collaborate with cross-functional teams to design and develop new packaging technologies
  • Qualify and release new packaging technologies to production
  • Work closely with OSATs and material partners to develop and bring up new packaging technology
  • Analyze electrical and package level reliability tests, including HAST, HTOL, ESD, Temperature cycle, dynamic warpage, CLR and BLR
  • Perform and interpret destructive and non-destructive package failure analysis
Requirements:
  • BS in material / mechanical / electrical engineering. Master's degree in engineering is preferred
  • Minimum of 3 years of experience executing semiconductor package NPI including package co-design, BOM definition, Flip-chip package technology, OSATs subcontractor management, package qualifications of component and board level, failure analysis, and electrical/thermal/mechanical interactions
  • Proven track record defining package BOM that enable device features creating value for customers
  • Deep understanding of FCCSP and FCBGA packages from perspectives of material characteristics, manufacturing, BOM, performance, supply chain, reliability, risk management and failure analysis
  • Working knowledge of SERDES package FOM such as material, thermal and mechanical performance, signal and power integrity, manufacturing risks, yield, etc.
Preferred Qualifications:
  • Allegro Package Designer (APD) experience for design verification for sign-off, generating reports and simple design changes
  • Broad packaging experience for example - heterogeneous packaging, flip-chip panel level designs, wafer level packaging

We offer a competitive salary and benefits package, as well as opportunities for professional growth and development. If you are a motivated and experienced Packaging Engineer looking for a new challenge, please submit your application.



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