Packaging Engineer
3 days ago
At InterSources, we are seeking a highly skilled Packaging Engineer to join our team. As a key member of our packaging team, you will be responsible for developing and implementing packaging solutions for our semiconductor products.
Job Summary:We are looking for a talented Packaging Engineer with a strong background in semiconductor packaging. The ideal candidate will have experience in package design, development, and qualification, as well as a deep understanding of package technologies and manufacturing processes.
Key Responsibilities:- Develop and implement packaging solutions for semiconductor products
- Collaborate with cross-functional teams to design and develop new packaging technologies
- Qualify and release new packaging technologies to production
- Work closely with OSATs and material partners to develop and bring up new packaging technology
- Analyze electrical and package level reliability tests, including HAST, HTOL, ESD, Temperature cycle, dynamic warpage, CLR and BLR
- Perform and interpret destructive and non-destructive package failure analysis
- BS in material / mechanical / electrical engineering. Master's degree in engineering is preferred
- Minimum of 3 years of experience executing semiconductor package NPI including package co-design, BOM definition, Flip-chip package technology, OSATs subcontractor management, package qualifications of component and board level, failure analysis, and electrical/thermal/mechanical interactions
- Proven track record defining package BOM that enable device features creating value for customers
- Deep understanding of FCCSP and FCBGA packages from perspectives of material characteristics, manufacturing, BOM, performance, supply chain, reliability, risk management and failure analysis
- Working knowledge of SERDES package FOM such as material, thermal and mechanical performance, signal and power integrity, manufacturing risks, yield, etc.
- Allegro Package Designer (APD) experience for design verification for sign-off, generating reports and simple design changes
- Broad packaging experience for example - heterogeneous packaging, flip-chip panel level designs, wafer level packaging
We offer a competitive salary and benefits package, as well as opportunities for professional growth and development. If you are a motivated and experienced Packaging Engineer looking for a new challenge, please submit your application.
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