asic lead engineer, project taara

4 weeks ago

Mountain View, California, United States X: The Moonshot Factory Full time
About the Role

The Taara Project at X is seeking an experienced ASIC lead engineer to drive the next generation of custom chip designs for cutting-edge wireless optical communication systems. As a key member of the R&D team, you will lead application-specific integrated circuit (ASIC) development from concept to product.

The successful candidate will set target specifications based on input from various teams, contribute to detailed circuit design, own the foundry submission process, oversee physical testing on returning hardware, and coordinate a small team of internal resources and external vendors.

The CMOS design will include analog mixed signal, radio frequency focused, and digital design for free-space optical communication links, including analog front-end, precision D/A and A/D converters, high-speed serializer/deserializer, clock and bias generation/distribution, and digital signal processing backend circuits.

What You Should Have
  • MS Electrical Engineering or related field
  • Experience in coordinating teams
  • Experience as a top-level chip owner and extensive tapeout experience, including successful bring-up and testing of mixed-signal SoC
  • Demonstrated achievements in pushing the boundaries of mixed-signal circuit design
  • Highly proficient in the use of standard IC design tools (Cadence Virtuoso, Innovus, etc.) and methodologies
  • Experience with production-grade design verification, including Monte-Carlo corner simulations and EM/IR/SI analysis of analog or digital blocks
  • Experience in selecting foundry technologies, working with foundries, and submitting tape-outs
Preferred Qualifications
  • Ph.D. Electrical Engineering or related field
  • Experience with integrated photonics design and/or co-design of electronics and photonics
  • Experience with millimeter-wave designs, integrated transmission lines, and related signal integrity
  • Experience with CAD tool setup and debugging
  • Familiarity with IC integration with photonics and related packaging technology
  • Experience with flip-chip packaging, interposer design, and vendor engagements for prototyping
  • Proficiency with Python and Git

The US base salary range for this full-time position is $168,000 - $210,000 + bonuses + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

At X, we don't just accept difference - we celebrate it, we support it, and we thrive on it for the benefit of our employees, our products, and our community. We are proud to be an equal opportunity workplace and are an affirmative action employer. We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender identity, or Veteran status. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements.

If you have a disability or special need that requires accommodation, please contact us at: x-accommodation-request@x.team

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