Semiconductor CMP Process Engineer

4 weeks ago

Palm Bay, United States L3Harris Technologies Full time

Job Title: Semiconductor CMP Process Engineer (Palm Bay, FL)

Job Code: 14708

Job Location: Palm Bay, FL



Job Description:

L3Harris Technologies is seeking a Semiconductor Chemical Mechanical Planarization (CMP) Process Engineer for our Palm Bay, FL location. As a Semiconductor CMP Process Engineer in the Microelectronics Division, you will support CMP tools and processes, perform data analysis for development and production work, identify process issues and process optimization opportunities, perform root cause analysis and drive mitigation strategies, perform qualification activies for new processes and tools, and provide sustaining engineering support in a manufacturing area. You will have regular interactions with equipment vendors, operations management, and a variety of engineering teams.



Essential Functions:

Qualify, setup, and operate semiconductor planarization equipment in a manufacturing cleanroom environment
Perform DOEs and process verification to bring new tools and processes online
Develop, optimize, and own CMP processes to drive device performance and yield improvement; create process documentation
Create and routinely monitor statistical process control (SPC)
Identify process drifts and catch potential excursions
Document out of control action plans (OCAPs) for processes failing SPC limits
Identify process and/or equipment issues; Lead investigation efforts for issues related to inline thin film processing
Recommend improvements for efficiency, cost, reliability and quality of existing products
Work with related integrated teams to drive, test, and implement approved plans
Perform on-the-job training for incoming new hires as the team grows
Maintain a safe and organized work environment



Qualifications:

Requires practical knowledge of job area. Bachelor’s Degree and a minimum of 2 years of prior related experience. Graduate Degree or equivalent with 0 to 2 years of prior related experience. In lieu of a degree, minimum of 6 years of prior related experience.
2+ years’ experience in semiconductor wafer manufacturing operations
Previous experience in advanced packaging and/or wafer-level processing
Exceptional organizational, verbal, and written communication skills
Must have computer skills including MS Windows and office products (excel, PowerPoint, word, and project)
Strong sense of responsibility, ownership, and follow-through
Must be a team player, pro-active, and customer-oriented with a sense of urgency to accomplish a given task or goal
Ability to lead teams, train, and mentor personnel
Security Clearance required upon hire: Ability to Obtain
Security Clearance required for role: Top Secret / SCI w/Poly

Preferred Additional Skills:

Bachelor’s Degree with 4+ years of prior relevant experience or Graduate Degree with 2+ years of prior related experience.
Active Top Secret Clearance
Lean Six Sigma Certification
Experience working in classified government programs
Previous experience working in a Class 100 cleanroom
Previous experience using commercial Manufacturing Execution Systems (MES)
Previous experience with semiconductor CMP equipment
Experience in implementing lean/six sigma techniques (FMEA, DFMA, DTC, DOE, and root cause/corrective action analysis)

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