Semiconductor Wet Etch Process Engineer

4 weeks ago

Palm Bay, United States L3Harris Technologies Full time

Job Title: Semiconductor Wet Etch Process Engineer (Palm Bay, FL)

Job Code: 14732

Job Location: Palm Bay, FL

Job Description:

L3Harris Technologies is seeking a Semiconductor Wet Etch Process Engineer for our Palm Bay, FL location.  As a Semiconductor Wet Etch Process Engineer in the Microelectronics Division, you will support wet etch tools and processes, perform data analysis for development and production work, identify process issues and process optimization opportunities, perform root cause analysis and drive mitigation strategies, perform qualification activies for new processes and tools, and provide sustaining engineering support in a manufacturing area.  You will have regular interactions with equipment vendors, operations management, and a variety of engineering teams.

**This role may provide relocation assistance to the selected candidate(s) if minimum requirements are met.**

Essential Functions:

  • Qualify, setup, and operate semiconductor wet etch and cleans equipment in a manufacturing cleanroom environment
  • Perform DOEs and process verification to bring new tools and processes online
  • Develop, optimize, and own wet etch and cleans processes to drive device performance and yield improvement; create process documentation
  • Create and routinely monitor statistical process control (SPC)
  • Identify process drifts and catch potential excursions
  • Document out of control action plans (OCAPs) for processes failing SPC limits
  • Identify process and/or equipment issues; Lead investigation efforts for issues related to inline thin film processing
  • Recommend improvements for efficiency, cost, reliability and quality of existing products
  • Work with related integrated teams to drive, test, and implement approved plans
  • Perform on-the-job training for incoming new hires as the team grows
  • Maintain a safe and organized work environment

Qualifications: 

  • Bachelor’s Degree and minimum 6 years of prior relevant experience. Graduate Degree and a minimum of 4 years of prior related experience. In lieu of a degree, minimum of 10 years of prior related experience.
  • 4+ years’ experience in semiconductor wafer manufacturing operations
  • Previous experience in advanced packaging and/or wafer-level processing
  • Ability to Obtain Top Secret / SCI w/Poly

Preferred Additional Skills:

  • Active Top Secret Clearance
  • Excellent communication and interpersonal skills to collaborate effectively with diverse teams.
  • Must have computer skills including MS Windows and Office products (Excel, PowerPoint, Word, and Project)
  • Strong sense of responsibility, ownership, and follow-through
  • Must be a team player, pro-active, and customer-oriented with a sense of urgency to accomplish a given task or goal
  • Ability to lead teams, train, and mentor personnel
  • Lean Six Sigma Certification
  • Experience working in classified government programs
  • Previous experience working in a Class 100 cleanroom
  • Previous experience using commercial Manufacturing Execution Systems (MES)
  • Previous experience with semiconductor wet etch equipment and benchtop processes
  • Previous experience with semiconductor wet etch processes including process development, new product introduction, and SPC parameter setup
  • Experience in implementing lean/six sigma techniques (FMEA, DFMA, DTC, DOE, and root cause/corrective action analysis)

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