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Hardware Engineer IV

3 months ago

Redmond, United States Mindlance Full time
Job Description: Position Title: Hardware Engineer IV

Role Mandate:
The main function of the structural/thermal simulation engineer is to work on structural and thermal simulations that support project designs.

Story Behind the Need:
This individual will support the Thermal Research Program. An example project that this individual will be working on the majority of the time involves performing structural simulations to support the development of a Client thermal material. This includes performing simulations to predict failure characteristics and (if possible) provide suggestions to improve performance of the material. Other projects will involve performing thermal simulations to assess impact.

Candidate Value Proposition:
An exciting aspect of this role is this will be a new material application that has not been achieved before. There is lots of room for providing input, or giving information for how decisions are made on how to manufacture the material. The individual will have high impact and room for research and development. There is potential to be more collaborative than other roles in the market. The team is collaborative and cross-functional, with lots of experts in different areas The team is open to ideas and questions, and is very supportive and always looking for solutions.

Role Responsibilities (including, but not limited to):
• Deliver simulation and analysis-based solutions to improve structural performance
• Collaborate with designers, engineers, and other cross-functional partners to identify risks, strategically create simulations, plan and conduct validation testing, and deliver objective, data-driven engineering guidance and solutions
• Contribute to the creation of product requirements and technical specifications
• Provide data and technical guidance for product architecture development efforts
• Organize and lead thermal design reviews, solution brainstorms, and implementation efforts
• Drive root cause efforts and design of experiments to resolve problems
• Present results in a form actionable by cross-functional team members and leadership
• Advance team capabilities using new methods, materials, technologies, and software tools

Performance Measurement:
Performance will be measured based on reviewing the individual's structural and thermal simulations (setting up and ensuring it was done correctly), making the correct assumptions, inputting things correctly into the software, and modeling appropriately.

Must-Have Skills:
• Finite Element Analysis (FEA)
• Structural analysis experience
• Thermal analysis experience - heat transfer of thermal dynamics / analysis
• Experience with composite materials
• Knowledge of engineering and physics-based principles related to heat transfer
• Knowledge of thermal finite element analysis
• Experience using a data-driven approach to analyze problems and deliver robust, optimized solutions
• Understanding of the mechanical and thermal properties for a broad spectrum of materials

Nice-to-Have Skills:
• Experience with polymers

Soft Skills:
• Strong verbal and written communication skills
• Analytical and problem solving ability
• Team player
• Detail-oriented
• Creativity
• Excitement about learning new skills and topics
• Strong organizational skills

Educational Requirements:
• Masters degree or equivalent experience in Mechanical Engineering, Physics, or a related field

Length of Contract: 12 months
Location: US - WA - Redmond
Is this role remote?: No, this role is to be located in Redmond (Building X)

Interview Process:
• 2 Rounds
• Virtual Interview

**Additional Notes**
• Candidates close to finishing PhD or right out of school is fine
• Candidates with no PhD must have at least 2 years of experience

EEO:

"Mindlance is an Equal Opportunity Employer and does not discriminate in employment on the basis of - Minority/Gender/Disability/Religion/LGBTQI/Age/Veterans."