Sr Specialist, Advanced Electronics Packaging Development Engineer

2 weeks ago

Palm Bay, United States L3Harris Full time

Job Title: Sr Specialist, Advanced Electronics Packaging Development Engineer

Job Code: 9331

Job Location: Palm Bay, FL

Job Description:

The L3Harris Microelectronics organization is growing our advanced packaging research and development efforts and capabilities. This role will allow you to pursue and then lead new business opportunities in Microelectronics related to advanced packaging including 2.5D and 3D Integration, high density build up, photonic integrated circuits, thermal management, and failure analysis. Your primary responsibilities will require basic understanding of government business acquisition models and deep understanding of challenges associated with low SWAP architecture and miniaturized electronic systems. The role will place you within a multidisciplinary team of scientists and engineers to deliver vital contributions to mission critical microelectronics solutions that help protect the U.S.A and our allies.

Essential Functions:

  • Work with Chief Engineers and subject matter experts (SMEs) to support opportunity development, shaping, pursuit, capture, winning, and then executions of advanced packaging and microelectronics business.

  • Develop proposals, statements of work, project plans, resource estimates, and material needs.

  • Promote emergent state-of-the-art practices

  • Lead new programs and projects in Microelectronics.

  • Ability to document, communicate, and present technical topics/recommendations/issues/concerns to internal and external customers.


Qualifications:

  • Bachelor's Degree in Electrical, Mechanical, Materials Science Engineering, Physics, or related field and minimum 6 years of prior relevant experience. Graduate Degree and a minimum of 4 years of prior related experience. In lieu of a degree, minimum of 10 years of prior related professional experience.

  • Ability to obtain US government Security Clearance

  • Experience with advanced microelectronic packaging including:

  • 3D die stacking and associated thermal, mechanical, and assembly issues

  • Through Silicon Vias (TSVs)

  • MEMS and wafer bonding

  • Failure analysis of 3D die stacks


Preferred Additional Skills:

  • Active security clearance

  • Silicon-level design and experience with design tools such as Tanner L-Edit, Cadence APD and Virtuoso

  • Experience with government programs and acquisition


L3Harris Technologies is proud to be an Affirmative Action/Equal Opportunity Employer. L3Harris is committed to treating all employees and applicants for employment with respect and dignity and maintaining a workplace that is free from unlawful discrimination. All applicants will be considered for employment without regard to race, color, religion, age, national origin, ancestry, ethnicity, gender (including pregnancy, childbirth, breastfeeding or other related medical conditions), gender identity, gender expression, sexual orientation, marital status, veteran status, disability, genetic information, citizenship status, characteristic or membership in any other group protected by federal, state or local laws. L3Harris maintains a drug-free workplace and performs pre-employment substance abuse testing and background checks, where permitted by law.

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