Senior Reliability Engineer Semiconductor

4 weeks ago

Liverpool, United States Fowler Placement Services Full time

Location Liverpool, NY

No Remote **Senior Reliability Engineer Semiconductor** (110-130K)

We are seeking a Senior Reliability Engineer to work for an exciting high-technology semiconductor manufacturer in the Syracuse, NY area.

**Overview****:**

* Competitive Salary, Lucrative Stock Options, Medical / Dental Benefits, Unlimited PTO, and much more.

* Outstanding Career Opportunity to Join a Fast Growing Start-Up Manufacturer with over 100M in assets.

**Key Duties and Responsibilities****:**

* Work with academic research partners to gather electromigration data and analyze it to predict wearout lifetimes in operation.

* Lead investigation on stress migration and temperature driven IMC growth in metal films.

* Work with process and device engineers to build-in reliability for advanced power devices, including the effects of high voltage, high current, and temperature.

* Perform wafer-level and package-level testing on devices and test structures to characterize device and materials intrinsic strength and defectivity.

* Investigate implementation or procurement of high current/high voltage test systems for reliability and device stability measurements.

* Perform numerical simulations on devices for electrical and thermal reliability.

**Education and Experience****:**

* Ph.D. or MS degree in Electrical Engineering, Physics, Material Science, or related field.

* 5+ years of semiconductor experience.

* Familiarity with (GaN, GaAs, SiC, or Si).

* Experience with reliability test lab instrumentation and laboratory procedures.

* Experience with reliability data analysis using JMP or other data analysis software.

* Experience with power device processing, design, or reliability a plus.

* Experience with thermal characterization of semiconductors and/or semiconductor packages and modules a plus.

* Experience with test control software development or analysis automation a plus.

**Keywords****:**

Reliability, Fab Back End Reliability, Electromigration, Stress Migration, Metal Reliability, Wafer Level Reliability, JMP.

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