Staff Thermal Systems Engineer, Google Cloud

3 weeks ago


Sunnyvale, United States Google Full time

Staff Thermal Systems Engineer, Google Cloud Sunnyvale, CA, USA Advanced Experience owning outcomes and decision making, solving ambiguous problems and influencing stakeholders; deep expertise in domain. Minimum qualifications Bachelor's degree in Mechanical Engineering, Product Design, or related field, or equivalent practical experience. 8 years of experience in electronics packaging/server systems/data center or related industry. Experience working with cooling strategies used for packages, boards, systems and data centers. Experience with developing and executing thermals technology innovation. Experience in one or more advanced cooling techniques such as liquid cooling, thermal interface materials, thermo-electric devices, two-phase heat transfer or heat exchangers. Experience working with OEM, ODM, and cooling system and component suppliers. Preferred qualifications Master's degree in Mechanical Engineering, Product Design, or related field, or equivalent practical experience. 12 years of experience in electronics packaging/server systems/data center. 5 years of experience with Computational Fluid Dynamics (CFD), thermal analysis modeling and characterization (e.g., FloTHERM, IcePak, and Computer Aided Design (CAD)). Experience in establishing project goals, coordinating resources, and providing technical leadership. Experience capturing temperature, pressure, velocity, power, flow rates, acceleration, displacement, acoustics. About the job Our computational challenges are so big and unique we cannot just buy our hardware, we have got to make it ourselves. Our Platforms Team designs and builds the hardware, software and networking technologies that power all of Google's services. As a Staff Thermal Systems Engineer, you will lead teams to design and evaluate our IT/data center thermal systems, identifying product requirements and contributing to research and project planning. From the chip to the data center, you will be responsible for designing and optimizing an architecture that will scale with Google's continued growth. With your technical expertise, you will lead and manage projects and technologies, develop product and process improvements, and provide consultation to others. The AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide. We're the driving force behind Google's groundbreaking innovations, empowering the development of our cutting‑edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world‑leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more. The US base salary range for this full‑time position is $174,000‑$258,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google (https://careers.google.com/benefits/). Responsibilities Act as a "go‑to" technical leader with in‑depth thermals knowledge of server, storage, machine learning, and different varieties of IT equipment systems. Lead projects to resource and enable qualification of thermal products from concept design to final production and deployment, collaborate with cross‑functional leaders and external vendors/partners to maintain and improve design, development/qualification processes. Contribute to overall system architecture from "chip to chiller" to optimize Total Cost of Ownership (TCO) of overall IT infrastructure, develop holistic thermal designs/architectures from package to data center level optimizing for cost and efficiency while innovating for performance. Develop appropriate specifications and test procedures as necessary to ensure desired reliability and performance of electronic equipment, collaborate, supervise, mentor, and motivate internal and external teams, to design and develop excellent products. Google is proud to be an equal opportunity and affirmative action employer. We are committed to building a workforce that is representative of the users we serve, creating a culture of belonging, and providing an equal employment opportunity regardless of race, creed, color, religion, gender, sexual orientation, gender identity/expression, national origin, disability, age, genetic information, veteran status, marital status, pregnancy or related condition (including breastfeeding), expecting or parents‑to‑be, criminal histories consistent with legal requirements, or any other basis protected by law. See also Google's EEO Policy (https://www.google.com/about/careers/applications/eeo/), Know your rights: workplace discrimination is illegal (https://careers.google.com/jobs/dist/legal/EEOC_KnowYourRights_10_20.pdf), Belonging at Google (https://about.google/belonging/), and How we hire (https://careers.google.com/how-we-hire/). If you have a need that requires accommodation, please let us know by completing our Accommodations for Applicants form (https://goo.gl/forms/aBt6Pu71i1kzpLHe2). Google is a global company and, in order to facilitate efficient collaboration and communication globally, English proficiency is a requirement for all roles unless stated otherwise in the job posting. #J-18808-Ljbffr



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