Specialist, Microelectronics Advanced Packaging Designer

4 weeks ago

Palm Bay, United States L3Harris Technologies Full time
Job Title: Specialist, Microelectronics Advanced Packaging Designer - Tapeout

Read on to find out what you will need to succeed in this position, including skills, qualifications, and experience.

Job Code: 16329

Job Location: Palm Bay, FL

Job Schedule: 9/80 (Every other Friday off)

Relocation: Relocation assistance is available to qualified applicants

Job Description:

The L3Harris Space and Airborne Systems Microelectronics organization is expanding our in-house advanced packaging research and development efforts and capabilities. As a member of our dynamic and collaborative environment, you will be responsible for working with EDA tools to solve challenging layout problems at the silicon level.

Essential Functions:
  • Write and modify DRC and LVS rule deck in PVS or Calibre for silicon tapeout.
  • Write Cadence SKILL routines for Virtuoso, APD, and general programming.
  • Develop custom checks as needed for verification and robustness.
  • Work with GDS and OAS file formats and translators.
  • Work closely with advanced packaging design team to improve design tools and submit bug findings and improvement recommendations.
  • Adapt to an evolving process and work closely with teammates providing up-to-date changes.
Qualifications:
  • Bachelor's Degree in Electrical Engineering and a minimum of 4 years of prior related experience. Graduate Degree or equivalent with 2 years of prior related experience. In lieu of a degree, minimum of 8 years of prior related experience
  • Experience with hierarchical design editing in EDA tools including Virtuoso, K-Layout, and/or L-Edit
  • Professional knowledge of coding in Python and/or MATLAB
  • Experience with foundry design rules encompassing minimum line widths, spaces, angles, and degassing
  • Professional experience with 3D layouts
Preferred Additional Skills:
  • Existing TS/SCI Clearance or ability to obtain one

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