Sr. Semiconductor Advanced Packaging Designer

4 weeks ago

Palm Bay, United States L3Harris Technologies Full time
Job Title: Sr. Semiconductor Advanced Packaging Designer (Cadence Allegro)

Read on to find out what you will need to succeed in this position, including skills, qualifications, and experience.

Job Code: 16822

Job Location: Palm Bay, FL

Job Schedule: 9/80 (Every other Friday off)

Relocation: Relocation assistance may be provided for qualified applicants

Job Description:

This role will require you to design complex die level component packages requiring knowledge of Silicon substrates, die stacking, TSVs and die attachment technologies. Designs will be captured using Cadence EDA tools including Advanced Package Designer (APD) and System Connectivity manager (SCM). Your primary responsibilities will require an understanding of advanced packaging technologies, packaging materials and material properties along with processes and an intimate knowledge of CAD SW and design verification tools. This position requires interface with the fabrication and assembly team with the opportunity to become more involved in these operations, designing interconnect test structures to enable chip-to-chip process development.

Essential Functions:
  • Work closely with a small team to achieve and develop designs for multi die packages using Cadence APD (Advance Package designer 24.1) and Cadence SCM. Understand and apply design verification software (PVS, LVS), incorporate design data in a Wafer level design working with internal and external foundry engineers coordinating fabrication features such as targets, metallization plans and process flows.
  • Candidate will be responsible for creating and maintaining schematics (Cadence SCM) and design databases (Cadence APD)
  • Must be able to adapt to an evolving process and work closely with teammates providing up to date changes.
  • Position will require individual to interface with other team members on tool development and process flow; as well as designing test structures for process development and integration.
  • Manages complex interposer designs, works across multiple industry standard/non-standard die design CAD tools, develops processes, performs failure analysis investigations, RCCAs, and leads a team of designers.
  • Create design process control documentation and mentor/lead other personnel on design rules and processes.
  • Work with general oversight and lead technical team of up to 6 additional engineers and designers.
  • Domestic and International Travel Required up to 25% of time
Qualifications:
  • Bachelor's Degree and a minimum of 9 years of prior relevant experience or Graduate Degree and a minimum of 7 years of prior related experience. In lieu of a degree, minimum of 13 years of prior related experience.
  • Ability to obtain a Top Secret/SCI U.S. government Security Clearance
  • Experience using Cadence Allegro Package Design suite
  • 5+ years experience with updating, operating, and designing with new semiconductor design CAD tools and processes
  • Prior or current experience documenting, communicating, and presenting technical topics/recommendations/issues/concerns to internal and external customers
  • Experience in advanced microelectronics packaging including through silicon vias, redistribution layers (RDL), chip stacking, and fan out
Preferred Additional Skills:
  • Active Top Secret/SCI clearance
  • Ability to lead a design team, size 2-10 people.
  • Experience using Cadence APD (Advance Package designer 24.1) and Cadence SCM
  • Experience with silicon photonics
  • Autocad, L-Edit, Klayout, or equivalent 2D mask layout tool

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