IC Package Design Engineer

3 weeks ago


San Diego, California, United States Apple Full time

You will be responsible for Package/SIP/module physical design and layout, optimization, design verification and tape out; and work with multi-functional teams to achieve optimized mechanical / electrical / thermal performance for various types of chips.Define and develop design verification and automation strategy to strengthen and streamline package design and release flows.Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.Hands-on experience with package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.)Good understanding of system specification and IC design, ability to work with design teams to translate IC / system requirement into package / SIP configuration.Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance).Design experience with RFIC and 5G packages, SIP or module schematic and layout design.



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