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Specialist, Microelectronics Advanced Packaging Designer
2 months ago
Job Title: Specialist, Microelectronics Advanced Packaging Designer – Tapeout
Job Code: 16329
Job Location: Palm Bay, FL
Job Schedule: 9/80 (Every other Friday off)
Relocation: Relocation assistance is available to qualified applicants
Job Description:
The L3Harris Space and Airborne Systems Microelectronics organization is expanding our in-house advanced packaging research and development efforts and capabilities. As a member of our dynamic and collaborative environment, you will be responsible for working with EDA tools to solve challenging layout problems at the silicon level.
Essential Functions:
- Write and modify DRC and LVS rule deck in PVS or Calibre for silicon tapeout.
- Write Cadence SKILL routines for Virtuoso, APD, and general programming.
- Develop custom checks as needed for verification and robustness.
- Work with GDS and OAS file formats and translators.
- Work closely with advanced packaging design team to improve design tools and submit bug findings and improvement recommendations.
- Adapt to an evolving process and work closely with teammates providing up-to-date changes.
Qualifications:
- Bachelor’s Degree in Electrical Engineering and a minimum of 4 years of prior related experience. Graduate Degree or equivalent with 2 years of prior related experience. In lieu of a degree, minimum of 8 years of prior related experience
- Experience with hierarchical design editing in EDA tools including Virtuoso, K-Layout, and/or L-Edit
- Professional knowledge of coding in Python and/or MATLAB
- Experience with foundry design rules encompassing minimum line widths, spaces, angles, and degassing
- Professional knowledge of 3D layouts
Preferred Additional Skills:
- Existing TS/SCI Clearance or ability to obtain one
