IC Package Design Engineer

1 month ago


San Diego, United States Apple Full time
  • You will be responsible for Package/SIP/module physical design and layout, optimization, design verification and tape out; and work with multi-functional teams to achieve optimized mechanical / electrical / thermal performance for various types of chips.
  • Hands-on experience with package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
  • SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.)
  • Good understanding of system specification and IC design, ability to work with design teams to translate IC / system requirement into package / SIP configuration.
  • Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance).
  • Design experience with RFIC and 5G packages, SIP or module schematic and layout design.
  • Define and develop design verification and automation strategy to strengthen and streamline package design and release flows.
  • Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.


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