Chip Packaging Technologist

corporate_fare Google place Sunnyvale, CA, USA Qualifications Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience. 8 years of experience with package development for high volume production. 8 years of experience with advanced packaging technology development. Preferred qualifications Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture. Experience working within assembly houses (OSATs) or wafer foundries. Knowledge of general package assembly processes, material selection, and reliability requirements at both the component and board levels. Understanding of the interactions between packaging technology, electrical design, thermal/mechanical performance, and manufacturability. Proficiency in 2.5D and 3D packaging technologies and advanced substrates for High-Performance Computing (HPC) applications. Proven track record in developing new technologies, driving innovation, and successfully implementing advanced packaging solutions. About the job In this role, you’ll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting‑edge TPU (Tensor Processing Unit) technology that powers Google's most demanding AI/ML applications. You’ll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's TPU. You’ll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML‑driven systems. Be part of a team developing custom silicon solutions for Google's direct‑to‑consumer products. Your expertise will shape next‑generation hardware experiences, delivering unparalleled performance and integration. We are seeking an experienced packaging engineer with strong leadership and project management skills who is detail‑oriented and operationally focused. In this role, you will work with multidisciplinary teams throughout custom silicon development, focusing on package substrate technology, design tradeoffs, assembly process evaluation, and mechanical reliability. As a Chip Packaging Technologist, you will develop advanced packaging solutions (2.5D/3D/3.5D) for ML chips. This involves collaborating with architects, Signal Integrity/Power Integrity (SI/PI), Thermal, and Printed Circuit Board (PCB) engineers to create high‑performance packages optimized for electrical performance and assembly. Responsibilities Define feasible boundaries for chip construction with architecture teams and own the packaging product lifecycle from initial definition through New Product Introduction (NPI). Drive packaging solutions (2.5D/3D) from concept to production, integrating manufacturing, electrical, thermal, and mechanical requirements. Develop and qualify advanced substrate solutions and build the ecosystem and supply chain necessary to support next‑generation package architectures. Drive collaboration with internal teams, Outsourced Assembly and Test (OSATs), and suppliers to deliver production‑ready solutions that maintain strict quality and reliability standards. Define Design for Excellence (DFx) methodologies and establish engineering plans using test vehicles to mitigate technical risks and ensure assembly process reliability. The US base salary range for this full‑time position is $183,000‑$271,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Google is proud to be an equal opportunity and affirmative action employer. We are committed to building a workforce that is representative of the users we serve, creating a culture of belonging, and providing an equal employment opportunity regardless of race, creed, color, religion, gender, sexual orientation, gender identity/expression, national origin, disability, age, genetic information, veteran status, marital status, pregnancy or related condition (including breastfeeding), expecting or parents‑to‑be, criminal histories consistent with legal requirements, or any other basis protected by law. See also Google's EEO Policy, Know your rights: workplace discrimination is illegal, Belonging at Google, and How we hire. #J-18808-Ljbffr