Mechanical Packaging Engineer
2 weeks ago
Overview Join Nokia's Advanced Packaging R&D team and be a key player in developing the next generation of high-performance electro-optic modules As a Mechanical Packaging Engineer, you'll drive the mechanical development of our cutting-edge coherent optical transceivers, integrating Silicon Photonics technology within our Photonic Service Engines. This role offers the opportunity to contribute from initial design concepts all the way through to New Product Introduction, making a significant impact on our innovative products. We invite you to apply and be part of this exciting journey Qualifications You have: Advanced Degree in Mechanical Engineering. 3-5 years of experience in high-volume packaging of 2.5/3D packages. Expertise in 3D CAD design, tolerance analysis, and Geometric Dimensioning and Tolerancing (GD&T) with SolidWorks or similar software. Expertise in thermal and thermo-mechanical simulations using ANSYS or similar software. Experience with package and process design/development from design to production. Expertise in material properties and yield/failure mode analysis. Experience with documentation of fabrication, inspection, and assembly processes. Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively. Expertise in materials property and process, yield analysis and enhancement, failure mode and analysis, Experience with Industry Test Standards, such as JEDEC, EIA, Telcordia, Mil-Std, etc. Responsibilities Leading Package Design and Architecture in collaboration with cross-functional teams and stakeholders to ensure package requirements are met. Innovate designs, applying Design for Manufacturing principles and with an eye towards production volumes and cost targets. Perform FEA structural analysis, including linear, nonlinear and dynamic studies using software. Perform thermal analysis, and coupled-physics involving thermal–structural, thermal-mechanical stress and thermo-electric analyses. Own and maintain mechanical drawings and manufacturing documentation along with Bill of Materials for new products. Plan and Drive prototype assembly builds to enable deliveries for early design validation. Drive package debug activities during product validation and qualification. Survey new materials and vendors for all Advanced Packaging activities. Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers. #J-18808-Ljbffr
-
Packaging Mechanical Engineer
2 weeks ago
Sunnyvale, United States Avicena Tech Full timePackaging Mechanical Engineer – Avicena Tech Join Avicena Tech, a privately held company headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland, developing microLED based ultra‑low power high bandwidth interconnects for chip‑to‑chip communications. This technology will revolutionize high‑performance computing, cloud...
-
Packaging Mechanical Engineer
2 weeks ago
Sunnyvale, United States Avicena Inc. Full timeAvicena is a privately held company developing microLED-based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is...
-
Mechanical Packaging Engineer
1 week ago
Sunnyvale, CA, United States Nokia Full timeJob Description Join Nokia's Advanced Packaging R&D team and be a key player in developing the next generation of high-performance electro-optic modules! As a Mechanical Packaging Engineer, you'll drive the mechanical development of our cutting-edge coherent optical transceivers, integrating Silicon Photonics technology within our Photonic Service Engines....
-
Package Mechanical and Thermal Engineer
4 days ago
Sunnyvale, United States Google Inc. Full timecorporate_fare Google place Sunnyvale, CA, USA Apply Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience. 2 years of experience in thermal analysis of semiconductor chips and packages. Experience in structural analysis software such as: Ansys Mechanical or Abaqus....
-
Senior Mechanical Packaging Engineer – Photonics
2 weeks ago
Sunnyvale, United States NOKIA Full timeA leading technology company is seeking a Mechanical Packaging Engineer to lead the design of innovative electro-optic modules. You will drive the development from concept to production, applying your expertise in CAD and thermal simulations. The ideal candidate has an advanced degree in Mechanical Engineering and experience in high-volume packaging...
-
Mechanical Packaging Engineer Co-op
2 weeks ago
Sunnyvale, United States NOKIA Full timeNumber of Positions: 1 Date: May 2026 - Aug 2026 Duration: 4 months Location: Onsite in Sunnyvale, CA or New York, NY Educational Recommendations Current M.S. or Ph.D. student in mechanical engineering, physics, or other similar fields or related field with an accredited school in US. Responsibilities Perform mechanical integrity and thermal simulations,...
-
Chip Thermal
4 days ago
Sunnyvale, United States Google Inc. Full timeA leading technology company in Sunnyvale, CA, seeks a Chip Thermal Mechanical Engineer to drive advancements in TPU (Tensor Processing Unit) technology for AI/ML applications. The role focuses on simulating mechanical and thermal performance of multi-chip packages, optimizing designs, and collaborating with system teams. The ideal candidate has a Bachelor's...
-
Mechanical Packaging Engineer Co-op
6 days ago
Sunnyvale, CA, United States Nokia Full timeJob DescriptionNumber of Positions: 1 Date: May 2026 - Aug 2026 Duration: 4 months Location: Onsite in Sunnyvale, CA or New York, NY EDUCATIONAL RECOMMENDATIONS Current M.S. or Ph.D. student in mechanical engineering, physics, or other similar fields or related field with an accredited school in US. ResponsibilitiesPerform mechanical integrity and thermal...
-
Mechanical Packaging Engineer Co-op
1 week ago
Sunnyvale, CA, United States Nokia Full timeJob DescriptionNumber of Positions: 1 Date: May 2026 - Aug 2026 Duration: 4 months Location: Onsite in Sunnyvale, CA or New York, NY EDUCATIONAL RECOMMENDATIONS Current M.S. or Ph.D. student in mechanical engineering, physics, or other similar fields or related field with an accredited school in US. ResponsibilitiesPerform mechanical integrity and thermal...
-
Mechanical Packaging Engineer Co-op
5 days ago
Sunnyvale, CA, United States Nokia Full timeJob DescriptionNumber of Positions: 1 Date: May 2026 - Aug 2026 Duration: 4 months Location: Onsite in Sunnyvale, CA or New York, NY EDUCATIONAL RECOMMENDATIONS Current M.S. or Ph.D. student in mechanical engineering, physics, or other similar fields or related field with an accredited school in US. ResponsibilitiesPerform mechanical integrity and thermal...