IC Packaging Mechanical Engineer

3 weeks ago


New Providence, United States Acceler8 Talent Full time

IC Packaging Mechanical Design Engineer - (New Providence, NJ)

Join a growing engineering team and develop cutting-edge optical modules for high-performance computing.


Responsibilities:

  • Design innovative packaging solutions for optical modules
  • Develop testing procedures and ensure product reliability
  • Troubleshoot technical challenges in packaging and materials
  • Build and maintain component models and technical drawings
  • Collaborate with internal and external teams for seamless integration


Qualifications:

  • BS in Mechanical Engineering
  • 2+ years of IC package design experience Or Ph.D. in Mechanical Engineering
  • Excellent communication skills


Preferred Skills:

  • SolidWorks (PDM) & FEA tools (ANSYS Mechanical)
  • Rapid prototyping (Formlabs 3D printing a plus)
  • Design for manufacturing (CNC, casting, MIM)
  • Optical module reliability (Telcordia GR-468)
  • Advanced IC packaging technologies (3D/2.5D IC, FOWLP, MCM FC-BGA)
  • High-speed test socket and connector experience



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