Thin Films Process Engineer

Found in: Talent US C2 - 2 weeks ago


San Jose, United States NEOPHOTONICS Full time
Careers

In successful companies, it is the people who make the difference.

Welcome to NeoPhotonics, where our people are making that difference; where results matter; where you see people have daily impact; where collaboration and team spirit count; where people enjoy what they do; and where we share our success with those who create it.

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In each of our locations, you will find talented people, stretch assignments, and fluid careers. We know that every employee has something important to offer, and believe that every employee should be integral to our success.

NeoPhotonics is proud to be an Equal Opportunity Employer and is committed to creating a diverse, innovative, and talented workforce where people are rewarded for what they do and how they do it, rather than who they know and where they come from.

Each new employee comes to NeoPhotonics with personal goals, dreams, and aspirations

Thin Films Process Engineer

Title: Thin Films Process Engineer FLSA Status: Location Name: San Jose,California,USA Description:

NeoPhotonics is developing the highest-speed optoelectronics which are critical to make the world more connected, mobile, efficient, and accessible solutions for tomorrow – in communications, cloud & cloud services, AI-enabled computing and transportation and its ecosystem, inter-satellite communications and autonomous vehicles. Silicon photonics is a leading-edge platform that enables mass productions of communication and sensing components and NeoPhotonics has demonstrated Silicon photonics chips for coherent receiver and LiDAR applications.

The Thin Films Diffusion Process Engineer is responsible for the wet thermal silicon oxidation, LPCVD deposition and high temperature reflow of doped oxides required for the manufacturing of advanced integrated photonic ICs assembled in the Silicon Valley PLC cleanroom, producing products for ultra-pure light lasers and optoelectronic products that transmit, receive and switch the highest speed over distance digital optical signals for Cloud and hyper-scale data center internet content provider and telecom networks. You will be working in a cross-functional team in a manufacturing environment to develop new materials and processes required to enable the next generation of PIC devices. You will be directly accountable for insuring high process yield, product quality, equipment uptime, and on-time delivery including the application of SPC methodologies and root-cause investigations required for continuous process improvement. The successful candidate should have a strong engineering background, excellent communication and team working skills and a desire to solve complex problems in a high tech manufacturing environment.

Responsibilities will include the following but not limited to:

Sustain thin film processes, trouble shoot process shift and device performance -based on SPC chart and device test results. Continuously work on improving process capacity and productivity in conjunction with FAB operators. Maintain and optimize process to improve Cpk and device yield. Is capable of performing data analysis, root cause investigation and developing project plans with minimal supervision. Constantly make prompt decision when tools are down, be proactive with a backup plan and coordinate with maintenance and technicians to insure process is running as designed. Work closely with maintenance technician for hardware and software failure analysis. Resolve major equipment issues as required.  Transfer new processes to production, including process set up, documentation, ECO and training. Take lead on identifying and purchasing new process and metrology tools, from facility layout to final acceptance paper work. Work closely with venders for FAT, tool set up, qualification, baseline set up and process qualification. Maintain close relationship with major vendors for continuous support. Regular interaction with other module engineers, improve processes or create new processes to improve throughput, capacity, fab yield as well as to decrease PM cost.

MS in Engineering and Sciences and 2-5 years of FAB related experience in thin film processing is preferred. Familiarity with CVD process is a plus.





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