Packaging Engineering Intern

2 months ago


Greensboro, United States Qorvo Full time

Responsibilities

may include: Learn about TD Technology Development projects methodologies - to help and improve the process Learn about Design Rules and Assembly Process - Forster and mentoring  Review Assembly and Marking diagram - look for opportunities to improve Material and BOM review and support of project deployment Onsite hands on learning semiconductor assembly processes - Other minor activities related to documentation and continuous improvement (A3s - Lean)

Qualifications:

BS in Materials Science or Mechanical Engineering Mechanical/Material Engineering skills Background with packaging materials (theoretical or practical). i.e. solder, epoxy, flux, mold compound preferred Background with assembly process (theoretical or practical). i.e. Wire Bond, Die Attach, Flip Chip preferred Communication and presentation skills Ability to manage and drive problem resolution Demonstrate strong analytical thinking skills 3.0 GPA or higher

This position is not eligible for Visa sponsorship by the company.



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