Principal Analog Mixed-Signal Design Engineer

2 months ago

Santa Clara, United States GTT, LLC Full time
Principal Analog Mixed-Signal Design Engineer
  • Direct Hire
  • Salary - $145k to 215k/year


Job Summary:

  • Our client's Broadband Analog group designs physical layer ICs for high-speed fiber optic data communication, such as Transimpedance Amplifiers (TIAs), and drivers for Silicon Photonic (SiPho) and discrete Electro-absorption Modulators (EAMs) and Mach-Zehnder Interferometer Modulators (MZMs).
  • This group is the market leader in delivering TIAs and Drivers for Data Center and Telecom markets.
  • They address the bandwidth, capacity, and power issues faced by cloud computing and mega data center networks.
  • Our world-class group leverages our core competencies in advanced circuit design to solve the world's ever-increasing desire to transmit more data for less power with fewer errors.
  • Our client is continually first to market in Data Center, Metro, and Long-Haul applications.
  • As a member of the design group, the Principal Analog Mixed-Signal Design Engineer will be responsible for the design and validation of FET and BiCMOS circuits for high-speed broadband ICs that serve these applications.


What You Can Expect

  • Our client is seeking an RF and Analog Design Engineer to contribute to the development of multi-tens GHz Transimpedance amplifiers TIAs.
  • These optical interface chips are tightly coupled with our high-performance equalizers.
  • The results of our innovative designs have made our TIAs best in class for coherent long-haul and metro systems as well as PAM4 data center systems.


Job Responsibilities:
In this role, Principal Analog Mixed-Signal Design Engineer will be responsible for:

  • Active circuit design as well as technical leadership.
  • Design leading edge trans-impedance amplifier design, primarily in Silicon Germanium (SiGe) BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) technology, where circuit performance will need to transcend beyond industry-leading products.
  • Develop transmission line structures and other millimeter wave structures to enable higher performance than would normally be achievable.
  • Design of hi-performance broadband analog circuits for optical front-end receivers.
  • Design of various other analog circuits including linear regulators, AGC loop, current/voltage sensors, bandgaps, etc.
  • Develop microarchitecture of major circuit blocks and guide a team of designers to implement them. Work with various technologies including SiGe BiCMOS and CMOS.
  • Work with other functional groups to facilitate post-silicon validation, qualification, transition to mass production, and customer support.


Job Requirements:

  • Bachelor's degree in Electrical Engineering in the areas of design of high-performance RF/Analog Receiver/TIA design and 10 - 15 years experience Or MSc EE Or PhD EE with 5+ years of experience in the areas of design of high-performance RF/Analog Receiver/TIA design.
  • Proven experience in IC design including chip tape-out AND lab evaluation of receiver design working in the industry).
  • Solid experience in.
    • Using EDA CAD tools
    • Performing Analog Custom Layout
  • Experience in measuring IC performance and debugging design to correlate simulations to measurements
  • Deep understanding of fundamentals, including:
    • Detailed transistor-level design
    • Device physics
    • Control/Feedback loop stability analysis
  • Direct project experience in at least one of the following areas is a plus:
    • AGC loop design
    • High-precision analog circuits (Including linear regulators, current sensors, bandgaps, and DAC/Client)
    • Experience in CTLE design
  • Experience in Package-System integration issues desired
  • Project experience in using different technologies. (SiGe BiCMOS is a plus)
  • A team-player
  • Experience in the following is a strong plus:
    • Overseeing and mentoring junior circuit designers
    • Experience as chip lead with success in silicon
    • Experience in taking chips to mass production
    • Ability to translate chip-level specifications into architecture
  • Strong communication, presentation, and documentation skills.


Location:

  • Westlake Village, CA, US


Benefits:

  • Medical, Vision, and Dental Insurance Plans
  • 401k Retirement Fund

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