RF Design Engineer

We are seeking an experienced RF Engineer with strong expertise in multilayer substrate design, preferably using organic materials, e.g., BT, ABF, or other advanced laminate substrates. The ideal candidate will have a solid foundation in microwave theory, high-speed signal integrity (SI), and power integrity (PI) in both the frequency and time domains. This role involves working closely with cross-functional teams to design, simulate, and validate high-speed and high-frequency interconnects for next-generation RF and mixed-signal modules.

• Design and develop RF/microwave multi-layer substrates and PCB, with emphasis on organic substrate materials and stack-up optimization.
• Perform electromagnetic and circuit-level simulations using ANSYS HFSS, Keysight ADS, and other modeling tools to ensure performance meets system-level requirements.
• Conduct signal integrity (SI) and power integrity (PI) analyses, including both frequency-domain (S-parameters, impedance) and time-domain (TDR/TDT, eye diagrams) evaluations.
• Collaborate with PCB/substrate layout engineers to define routing rules, via structures, and impedance control for high-speed and RF interconnects.
• Support design verification and characterization using Vector Network Analyzer (VNA), Time Domain Reflectometer (TDR), and high-speed oscilloscopes.
• Work with manufacturing partners to ensure DFM/DFE compliance and yield optimization for advanced substrates.
• Interpret and correlate measurement data with simulations to refine models and improve design accuracy.
• Document design methodologies, results, and best practices to support continuous improvement and team knowledge sharing.

You have

• Bachelor's or Master's degree in Electrical Engineering, 3+ years of industry experience in RF/microwave or high-speed hardware design (senior levels may require 5–8+ years).
• Proven experience with organic multilayer substrate design (e.g., ABF, BT, or similar). Proven experience with high-speed PCB materials
• Strong understanding of microwave network theory, S-parameters, impedance matching, and transmission line theory.
• Hands-on experience with HFSS, ADS, or equivalent simulation tools.
• Familiarity with high-speed measurement tools such as VNA, TDR, and high-bandwidth oscilloscopes.
• Knowledge of EM model extraction, de-embedding techniques, and measurement correlation.

It would be nice if you also had:

• Experience with RF module integration or system-in-package (SiP) technologies. Familiarity with 3D EM–circuit co-simulation
• Understanding of manufacturing processes for organic substrates, including lamination, via formation, and surface finish techniques.
• Experience working with EDA tools (Altium, Allegro APD, Mentor Xpedition, or similar) for layout and stack-up design.
• Experience with power distribution network (PDN) design and analysis is a plus.

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