Senior Electrical Engineer

5 days ago


Santa Clara, CA, United States ACL Digital Full time
Job Description: Senior Electrical Engineer - Advanced Semiconductor Packaging and Integration

Company Overview
Join our team and be at the forefront of semiconductor technology innovation. We are looking for a highly skilled Senior Engineer to contribute to our cutting-edge projects in Advanced Semiconductor Packaging and AI. You will work alongside some of the brightest minds in the industry and have the opportunity to make a significant impact on the future of AI.
Position Overview
We are seeking a Senior Electrical Engineer with a strong background in Advanced Semiconductor Electronics and ASIC Design. The ideal candidate will have extensive knowledge in mixed-signal design, chiplet design, and advanced packaging, with a deep understanding of BEOL and FEOL semiconductor processing.
Responsibilities
  • Lead the design and development of advanced semiconductor electronics and ASICs.
  • Develop and optimize mixed-signal designs.
  • Oversee semiconductor processing and advanced packaging technologies.
  • Integrate HBM and LPDDR memory into system designs.
  • Implement chiplet integration techniques focusing on high-speed chiplet I/O.
  • Ensure signal and power integrity throughout the design process.
  • utomate chip layout generation and format conversion.
  • Design PCBs with a focus on performance and reliability.
  • Conduct thermal simulations for optimal thermal management.
  • Substrate design and documentation.
  • Top-Level system design and floorplan.
  • Overall ASIC and Chiplet design flow.
  • rchitecture documentation.
  • EDA tools setup.
  • Collaborate with cross-functional teams for seamless integration and timely delivery.
  • Mentor and guide junior engineers.
Requirements
  • M.S in Electrical Engineering, Computer Engineering, or a related field.
  • Extensive experience in advanced semiconductor electronics and ASIC design.
  • Proficiency in mixed-signal design and semiconductor processing techniques.
  • Strong knowledge of advanced packaging technologies, including HBM and LPDDR integration.
  • Experience with chiplet integration and high-speed chiplet I/O.
  • Expertise in signal integrity, power integrity, and automated chip layout generation.
  • Proven track record in PCB design and thermal simulations.
  • Excellent leadership, communication, and project management skills.
Preferred Qualifications
  • Ph.D. in a relevant field.
  • Experience with leading industry-standard design and simulation tools.
  • Published works or patents in semiconductor technologies.


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