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Tempe, AZ, United States ViaSat Full timeAbout usOne team. Global challenges. Infinite opportunities. At Viasat, we're on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We're looking for people who think big, act fearlessly, and create an...
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About usOne team. Global challenges. Infinite opportunities. At Viasat, we’re on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We’re looking for people who think big, act fearlessly, and create an inclusive environment that drives positive impact to join our team. What you'll doViasat is a rapidly growing technology company that designs, deploys and operates cutting edge SATCOM products and services as well as advanced Military and Government programs. At Viasat you'll work with highly-motivated engineers in an exciting, dynamic, yet informal environment in the development of RF- mmWave and high speed digital semiconductor packaging solutions and systems. The packaging development process includes package definition, stack-up, substrate layout, bond diagram, simulation, technical risk/cost assessment, materials and process characterization, and compilation of formal documentation. The day-to-dayIn this role, you will have the opportunity to be a team member with other top notch mechanical engineers. Your experience in physical design of microelectronics hardware will be valued as your become the go to person in performing structural, thermal, and dynamic analysis for commercial, military, or space hardware. You will be empowered to make positive contributions and decisions in design, testing, and prototype fabrication. Your people skills will come to play as you work closely with team mates, subcontractors, and our customers. What you'll need5+ years experience in RF/Microwave module level electronic packaging design or similar work.Experience with 2D and/or 3D mechanical design toolsKnowledge of thermal analysis of electronic packaging designKnowledge of finite element modeling techniques and softwareKnowledge of packaging microwave electronics for space environmentsBachelor's Degree in Mechanical Engineering or equivalentUS Government position. US Citizenship requiredAbility to travel up to 10% What will help you on the jobMasters of Science Degree in Mechanical EngineeringExperience with the following tools: Solidworks, Solidedge, ANSYS, CATIAClearance: TS/SCI Salary range$108,000.00 - $171,000.00 / annually. For specific work locations within San Jose, the San Francisco Bay area and New York City metropolitan area, the base pay range for this role is $134,000.00- $201,000.00/ annually At Viasat, we consider many factors when it comes to compensation, including the scope of the position as well as your background and experience. Base pay may vary depending on job-related knowledge, skills, and experience. Additional cash or stock incentives may be provided as part of the compensation package, in addition to a range of medical, financial, and/or other benefits, dependent on the position offered. Learn more about Viasat’s comprehensive benefit offerings that are focused on your holistic health and wellness at https://careers.viasat.com/benefits. EEO StatementViasat is proud to be an equal opportunity employer, seeking to create a welcoming and diverse environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, ancestry, physical or mental disability, medical condition, marital status, genetics, age, or veteran status or any other applicable legally protected status or characteristic. If you would like to request an accommodation on the basis of disability for completing this on-line application, please click here.
