Assembly and Packaging Engineer
4 days ago
We are seeking a skilled Assembly and Packaging Engineer to lead the development and improvement of advanced assembly processes for various applications. The ideal candidate will have a strong technical background in semiconductor device packaging, along with knowledge of high-density interconnect technologies.
The responsibilities of this role include collaborating effectively with foundry customers and colleagues, overseeing process development in areas such as wafer back-end manufacturing, die singulation, wire bonding, and final PCB laminate assembly.
A competitive salary is offered for this position, ranging from $120,000 to $180,000 per year, depending on experience.
Required Skills and Qualifications- A minimum of 5 years of experience in semiconductor packaging engineering, with a comprehensive understanding of advanced packaging technologies.
- A minimum of three (3) years of supervisory experience in a health or social services program, with experience directing a senior care program.
- Experience working in a manufacturing and/or cleanroom environment.
- Experience working and developing processes on manufacturing equipment.
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