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HBM Memory Lead Design Engineer
2 months ago
We are seeking a highly skilled HBM Memory Lead Design Engineer to join our DRAM and Emerging Memory Group (DEG) at Micron Technology. As a key member of our team, you will be responsible for directing a team that crafts and analyzes digital and analog circuits used to develop memory products. This includes simulating, optimizing, and floor planning DRAM circuits.
Key Responsibilities- Direct a team of engineers in the development of new HBM product opportunities
- Assist with the overall design, layout, and optimization of Memory, Logic, and Analog circuits
- Oversee and manage the layout process, including floor planning, placement, and routing
- Perform verification processes with modeling and simulation using industry-standard simulators
- Collaborate with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure proper manufacturability of the product
- BSEE or greater
- 10+ years of relevant DRAM Design Engineering experience
- Familiarity with DRAM operation and JEDEC specifications, preferably with the HBM product family
- Good understanding of timing/area/power/complexity tradeoffs
- Experience delivering highly technical solutions
- Good verbal and written communication skills with the ability to efficiently synthesize and convey sophisticated technical concepts to other partners and leadership
- Consistent track record of innovation and problem-solving in high-performance memory development
- A self-motivated, hard-working team player who enjoys working with diverse abilities and backgrounds
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. We are committed to your personal wellbeing and professional growth, offering a choice of medical, dental, and vision plans, paid time-off, and paid holidays. We are proud to be an equal opportunity workplace and an affirmative action employer.