Packaging Engineer: Develop Innovative Solutions for Data Storage
6 days ago
Western Digital is a leading innovator in data storage solutions, and we are seeking a skilled Packaging Engineer to join our team. This role will involve developing innovative solutions for semiconductor packaging, flash memory products, and host levels.
About the CompanyWe are a global company with over 50 years of experience in memory and data storage technology. Our mission is to unlock the potential of data, enabling people, companies, and organizations to create what's next.
We are committed to providing equal opportunities to all applicants and employees, regardless of their background or characteristics. We believe that diversity is a strength and strive to create an inclusive environment where everyone can thrive.
Job SummaryThis is a key position within our Packaging R&D group, responsible for influencing package and product design by addressing structural integrity and reliability issues. The ideal candidate will have a solid background in applied mechanics, especially computational and/or experimental solid mechanics, and in-depth knowledge of IC packaging.
The successful candidate will be responsible for modeling and simulation, design of experiment, and testing of mechanical responses of IC packages and flash products. They will interface with package & product design, electrical and physical characterization, reliability testing, failure analysis, assembly R&D, and other process teams.
We offer a comprehensive salary range of $145,000 - $190,000 per year, based on qualifications and experience. This includes a base salary, annual bonus, and long-term incentive plan. Benefits include paid vacation time, medical/dental/vision insurance, life insurance, and more.
Responsibilities- Influence package and product design by addressing structural integrity and reliability issues.
- Responsible for modeling and simulation, design of experiment, and testing of mechanical responses of IC packages and flash products.
- Interface with package & product design, electrical and physical characterization, reliability testing, failure analysis, assembly R&D, and other process teams.
- Ph.D. in Mechanical Engineering plus >3 years, or M.S. in Mechanical Engineering plus >5 years of relevant industrial experience.
- Solid knowledge through academic coursework or experience required in mechanical engineering of IC packaging and related areas.
- Strong background in computational solid mechanics and/or experimental solid mechanics with emphasis on failure analysis and design of experiment.
- Broad knowledge of mechanical behaviors of various material types, including composite laminates, polymers, and metals (e.g., solder).
- Working knowledge in designing and conducting mechanical testing and/or using a commercial FEA package.
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