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Senior RF Microwave Design Engineer

2 months ago

Baltimore, Maryland, United States Northrop Grumman Full time
Job Title: Senior RF Microwave Design Engineer

Northrop Grumman is seeking a highly skilled Senior RF Microwave Design Engineer to join our team in Baltimore, MD. As a key member of our Electrical Design and Analysis (EDA) section, you will be responsible for designing, modeling, and verifying RF/microwave and mixed signal circuit card assemblies (CCAs) for various electronic sensor products.

The ideal candidate will have a strong background in RF/microwave and mixed signal circuit design, with experience in test and troubleshooting complex mixed signal CCAs. You will be working on multi-discipline engineering teams and communicating clearly within integrated product team leads. Additionally, you will be responsible for managing RF budgets, frequency planning, and common assembly level interfaces.

We are looking for a candidate with a Bachelor's degree in Electrical Engineering or a comparable STEM degree, with a minimum of 9 years of relevant engineering experience. You will have expertise in industry-standard RF/microwave modeling, simulation, and printed circuit board design tools, such as ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, and TICRA.

The successful candidate will have a strong understanding of RF budgeting, frequency planning, and RF chain analysis and modeling. You will also have experience in integrating FPGA/Digital controls on the bench and understanding of basic signal processing. Additionally, you will have expertise in ceramic and organic printed circuit board materials, design, fabrication, and assembly processes, as well as integrated circuit packaging techniques.

We offer a competitive salary range of $127,000 - $190,600, with opportunities for growth and professional development. If you are a motivated and experienced RF Microwave Design Engineer looking for a new challenge, please apply today

Key Responsibilities:

  • Design, model, and verify RF/microwave and mixed signal CCAs for various electronic sensor products
  • Manage RF budgets, frequency planning, and common assembly level interfaces
  • Work on multi-discipline engineering teams and communicate clearly within integrated product team leads
  • Utilize industry-standard RF/microwave modeling, simulation, and printed circuit board design tools
  • Integrate FPGA/Digital controls on the bench and understand basic signal processing
  • Expertise in ceramic and organic printed circuit board materials, design, fabrication, and assembly processes
  • Integrated circuit packaging techniques

Requirements:

  • Bachelor's degree in Electrical Engineering or comparable STEM degree
  • Minimum of 9 years of relevant engineering experience
  • Expertise in industry-standard RF/microwave modeling, simulation, and printed circuit board design tools
  • Strong understanding of RF budgeting, frequency planning, and RF chain analysis and modeling
  • Experience in integrating FPGA/Digital controls on the bench and understanding of basic signal processing
  • Expertise in ceramic and organic printed circuit board materials, design, fabrication, and assembly processes
  • Integrated circuit packaging techniques

Preferred Qualifications:

  • Active Top Secret / SCI security clearance
  • Experience in Worst Case Circuit Analysis (WCCA) including logic compatibility, component derating, timing analysis, signal and power integrity analyses
  • Signal integrity analysis (SERDES, Bit error rates, jitter components and contributors, board to board analysis)
  • Expertise in working with receiver/exciters, conducting RF performance analysis, and implementing digital beamforming
  • High-speed digital circuit design experience
  • Familiarity with Point of Load (PoL) design
  • Experience in integrating FPGA/Digital controls on the bench (no VHDL experience required)
  • Understanding of basic signal processing
  • RF budgeting, frequency planning, RF chain analysis and modeling
  • Component selection and/or custom component requirements flow down and trades
  • Ceramic and organic printed circuit board materials, design, fabrication, and assembly processes
  • Integrated Circuit packaging techniques including chip-and-wire, QFN, flip-chip
  • Product life cycle support from concept through production support
  • Designing for high reliability, space requirements and environments
  • AESA / phased array, Radar, SIGINT, or SATCOM experience