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Director of Advanced Packaging Innovation
2 months ago
As a pioneering leader in the field of advanced packaging architecture, you will play a crucial role in shaping the future of semiconductor innovation at SK Hynix America.
About UsWe are at the forefront of developing cutting-edge memory solutions that power everything from smartphones to data centers. Our team is dedicated to advancing mobile technology, empowering cloud computing, and pioneering future technologies.
We're committed to sustainability and have significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices.
Salary and BenefitsThe estimated salary for this position ranges from $220,000 to $254,000 per year, depending on location and experience. Our benefits package includes top-tier health insurance, paid time off, parental leave, 401k matching, educational reimbursement, donation matching, corporate discount programs, and free meals.
Job DescriptionYou will lead the development of advanced packaging system architecture to improve System in Package performance, including High Bandwidth Memory (HBM). This involves driving mechanical and electrical test vehicle design and development when necessary, researching and developing novel technologies for System in Package performance improvement, and collaborating with internal and external stakeholders.
Required skills include a Bachelor's degree in Electrical Engineering or equivalent industry experience, 7+ years of experience in advanced packaging architecture definition and development, effective communication skills, and experience working effectively with cross-functional teams.
Responsibilities- Lead advanced packaging system architecture development to improve System in Package performance
- Drive mechanical and electrical test vehicle design and development when necessary
- Research and develop novel technologies for System in Package performance improvement along with SOC and HBM heterogeneous integration
- Collaborate with internal and external stakeholders to ensure seamless advanced packaging technology development
- Master Degree or PhD in Electrical Engineering or equivalent industry experience
- 10+ years of experiences in advanced packaging architecture definition and development (2.5D/3D)
- Working knowledge in 2.5D/3D packaging technologies and large body substrate technologies
- Working knowledge in Signal integrity and Power integrity
- Experience in High Bandwidth Memory (HBM) architecture is a plus