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Micro Assembly Process Engineer

2 months ago

Livermore, California, United States FormFactor Full time
About FormFactor

FormFactor, Inc. is a leading supplier of semiconductor test and measurement products that power electronic systems used in computing, consumer technology, automotive, Artificial Intelligence (AI), and other applications. Our cutting-edge solutions are the driving force behind the testing of ICs that power electronic systems across various industries.

Job Summary

We are seeking a highly skilled and experienced Micro Assembly Process Engineer to join our team in Livermore, CA. The successful candidate will be responsible for probe card manufacturing process development, sustaining and improving existing products, providing training, and leading troubleshooting and repair of complex probe cards and sub-assemblies.

Key Responsibilities
  • Perform functions associated with all probe card manufacturing engineering & operations, including direct material part flows, build management, incoming/Outgoing quality inspection, part/assy issue disposition & inspection.
  • Support to the Manufacturing Engineering activity by recognizing, prioritizing & acting improvement opportunities, pioneering new ideas, and finding innovative methods to accomplish production goals.
  • Create or update operator work instructions for various processes and process improvements.
  • Create or update Visual Defect Criteria with Revision control that is used to enable operators to disposition non-conformances.
  • Implement & log 'One Point Lessons' for immediate issue containment, timely follow-up to integrate into WI's.
  • Perform operator Core trainer training and certification across CWW shifts.
  • Coach or train technicians, to develop teamwork, leadership, and technical skills.
  • Participate in tests and experiments to improve production processes or develop new products and processes.
  • Support modifications of automated assembly systems process / alignment measurement parameters and create/modify procedures for new products.
  • Submit tasks to update & modify factory MES system routings & data collection.
  • Maintain SPC for critical process & equipment function indicators.
  • Support first article probe cards including mechanical substrate alignment & sub-assembly, associated new tooling introduction, initial set-up and verification, various metrology steps & rework if necessary.
  • Lead troubleshooting and repair of complex probe cards and sub-assemblies.
  • Project manage & participate in assembly equipment HW & SW upgrades based on process quality & throughput objectives.
  • Provide input for capacity analysis to establish Human or Equipment needs to drive Product ramps; work with production supervisors to ensure their team is postured to meet capacity needs.
  • Participate in equipment capacity increases / CapEx Projects & product related tooling capacity increases to ensure we meet capacity demand.
Requirements
  • BS in engineering, CS, or physics; MS or PhD preferred with + 4-6 years of experience or equivalent.
  • Prior probe card troubleshooting, repair and maintenance experience preferably at customer sites as FSE (Field Service Engineer) is a big plus.
  • Have solid computer skills (MS Word, MS Excel, MS Power Point, JMP).
  • Experience with application of statistical process control (SPC) methodologies in a manufacturing environment.
  • Good communication skills, both oral and written.
  • Demonstrated strong structured problem-solving skills with common sense as related to manufacturing issues.
  • Familiarity with mechanical machined parts, CAD component & assembly drawings.
  • Able to use hierarchy BOM structure to determine parts required for builds.
  • Able to work with limited supervision, is self-directed, and has a methodical approach to solving technical problems.
  • Able to work with high power microscopes and automated stages.
  • Have excellent manual dexterity.
  • Familiarity with clean room procedures.
Working Conditions

Sitting, standing, and working in a clean room environment for prolonged periods of time - up to 8 hours or more per day. Must be available to work overtime and weekends when the job demands it - based on commitment to objectives. Able to work in a cleanroom environment per semiconductor protocol/requirements.