Senior Engineering Manager, Product Development

3 weeks ago


Milpitas, California, United States Western Digital Full time
Job Overview

We are seeking a highly skilled Packaging Engineer to join our Packaging R&D group at Western Digital.

The ideal candidate will have a strong background in applied mechanics, especially computational and/or experimental solid mechanics, and in-depth knowledge of IC packaging.

About the Role

This position involves influencing package and product design by addressing structural integrity and reliability issues. You will be responsible for modeling and simulation, design of experiment, and testing across semiconductor packaging, flash memory products, and host levels.

You will interface with package & product design, electrical and physical characterization, reliability testing, failure analysis, assembly R&D, and other process teams.

Responsibilities
  • Influence package and product design by addressing structural integrity and reliability issues.
  • Modeling and simulation, design of experiment, and testing across semiconductor packaging, flash memory products, and host levels.
  • Interface with package & product design, electrical and physical characterization, reliability testing, failure analysis, assembly R&D, and other process teams.
Qualifications
  • Ph.D. in Mechanical Engineering plus >3 years, or M.S. in Mechanical Engineering plus >5 years of relevant industrial experience.
  • Solid knowledge through academic coursework or experience required in mechanical engineering of IC packaging and related areas.
  • Strong background in computational solid mechanics and/or experimental solid mechanics with emphasis on failure analysis and design of experiment.
  • Broad knowledge of mechanical behaviors of various material types, including composite laminates, polymers, and metals (e.g., solder).
  • Working knowledge in designing and conducting mechanical testing and/or using a commercial FEA package.
  • Good understanding of general semiconductor packaging processes, materials, technology, and trends, such as substrate design and manufacturing, molding, wire-bonding, die attach, flip chip, TSV, hybrid bonding, etc.
Additional Information

We offer a comprehensive package of benefits, including paid vacation time, paid sick leave, medical/dental/vision insurance, life, accident, and disability insurance, tax-advantaged flexible spending and health savings accounts, employee assistance program, and more.

An estimated annual salary for this role is $120,000 - $160,000 based on industry standards and market conditions.



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