Electronics Packaging Engineer

4 days ago


Santa Clara, California, United States Apple Full time

**About the Position**

We are looking for a talented IC Package Design Engineer to join our Hardware Technology Packaging team at Apple. In this role, you will design and develop electronic packaging solutions for our internal and custom external components of hardware for our consumer electronic products.

You will be responsible for owning and driving sophisticated package selection, new generation product package structure and configuration optimization. This involves Package/SIP/module physical design and layout, optimization, DV and tape out; and working with multi-functional teams to achieve optimized mechanical/electrical/thermal performance for various types of chips.

The ideal candidate will have familiarity with various sophisticated package configurations and assembly/substrate technology and experience in package design using Cadence Allegro platform tools or Mentor Xpedition platform tools.

**Responsibilities and Qualifications**

  • Familiarity with various sophisticated package configurations and assembly/substrate technology.
  • Experience in package design using Cadence Allegro platform tools or Mentor Xpedition platform tools.


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