Senior Microelectronics Packaging Expert

7 days ago


Palm Bay, Florida, United States Top Secret Clearance Jobs Full time

About the Role: We are seeking an experienced Senior Microelectronics Packaging Expert to join our team. As a key member of our design team, you will be responsible for designing complex die level component packages using Cadence Allegro tools.

Job Overview: This role requires a strong understanding of advanced packaging technologies, including through silicon vias, redistribution layers (RDL), chip stacking, and fan out. You will work closely with a small team to achieve and develop designs for multi-die packages.

Main Responsibilities:

  • Design complex die level component packages using Cadence Allegro Package Design suite.
  • Work closely with the fabrication and assembly team to ensure seamless integration of designs.
  • Develop and maintain schematics and design databases using Cadence SCM and APD.
  • Collaborate with teammates to adapt to evolving processes and ensure up-to-date changes are implemented.
  • Interface with other team members on tool development and process flow, as well as designing test structures for process development and integration.
  • Manage complex interposer designs, work across multiple industry standard/non-standard die design CAD tools, and develop processes.

Qualifications:

  • Bachelor's Degree and a minimum of 9 years of prior relevant experience or Graduate Degree and a minimum of 7 years of prior related experience.
  • Ability to obtain a Top Secret/SCI U.S. government Security Clearance.
  • Experience using Cadence Allegro Package Design suite.
  • 5+ years experience with updating, operating, and designing with new semiconductor design CAD tools and processes.
  • Prior or current experience documenting, communicating, and presenting technical topics/recommendations/issues/concerns to internal and external customers.

Preferred Skills:

  • Active Top Secret/SCI clearance.
  • Ability to lead a design team, size 2-10 people.
  • Experience using Cadence APD (Advance Package designer 24.1) and Cadence SCM.
  • Experience with silicon photonics.
  • Autocad, L-Edit, Klayout, or equivalent 2D mask layout tool.

What We Offer: Competitive salary, comprehensive benefits package, and opportunities for career growth and professional development.



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