Silicon Photonics Packaging Specialist

2 weeks ago


San Francisco, California, United States Ouster Full time
Job Overview

Ouster is a leading provider of sensors and tools for engineers, roboticists, and researchers. We are seeking a skilled Silicon Photonics Packaging Engineer to join our team.

Responsibilities
  • Design microelectronic assembly processes for receiver and transmitter packages/modules from wafer fab to package integration.
  • Define specifications for custom IC package designs and chip carriers to meet product and qualification requirements.
  • Plan and execute process optimization and characterization, design validation, failure analysis, and sample builds for package development and automotive qualification.
  • Lead yield analysis and drive improvement/corrective actions for silicon process and microelectronic assembly.
Qualifications
  • 5+ years in Semiconductor Package/Process Development or 2+ years with a relevant masters degree.
  • Experience with multi-layer ceramic, CMOS image sensor, BGA packages, and organic substrates.
  • Experience in wafer level processing (dielectric thin film deposition, RIE silicon processing, wafer-to-wafer bonding, spin coat/lift-off processing, wafer dice and test).
Benefits

We offer a competitive salary range of $120,000 - $180,000 per year, depending on your skills and experience. Our benefits include:

  • 15 vacation days/10 paid holidays annually;
  • paid parental leave;
  • pre-tax commuter or health care/dependent care accounts;
  • 401K match up to 4%;
  • medical, vision and dental plans with premiums covered at 100% for the employee and 75% for dependents (Cigna or Kaiser);
  • life insurance;
  • short term disability and long term disability.


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