DRAM Packaging Engineer

2 weeks ago


San Diego, California, United States Apple Full time
DRAM Packaging Engineer Job Description

At Apple, we're seeking a highly skilled DRAM Packaging Engineer to join our Hardware Technologies team. As a key member of our team, you will be responsible for developing and integrating electronic packaging solutions for Apple's consumer electronic products.

Key Responsibilities:

  • Define the memory package plan of record, including package architecture, technology, process, form factor, layout, bill of materials, design rules, thermomechanical, signal integrity, and power integrity.
  • Publish internal package specs for customized memory.
  • Establish trusting and collaborative relationships with vendors for DRAM memory package development and qualification.
  • Review, drive, and approve DRAM memory vendors' DOEs/characterization plans, technology, and product qualification data for package development.
  • Drive industry advancements in sophisticated package processes, new materials, and groundbreaking specifications.

Requirements:

  • 5+ years of experience in package design and assembly process development for memory wirebond, stacked-die packages.
  • Proven understanding of assembly design rules, SIPI, and layout tradeoffs to enable high-performance DDR or differential signaling.
  • Knowledgeable in packaging materials, substrate technology, and their mechanical and thermal behaviors.
  • Shown working experience in package test and reliability, system-level downstream process interaction, and packaging inspection metrology.
  • Excellent engineering problem-solving skills, with strong engineering physics and data-driven analysis.
  • Strong written and verbal communication skills for working with internal multi-functional teams and OSATs.

Benefits:

  • Comprehensive medical and dental coverage.
  • Retirement benefits.
  • A range of discounted products and free services.
  • Reimbursement for certain educational expenses related to advancing your career at Apple.


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