IC Package Design Engineer

1 week ago

San Diego, California, United States Apple Full time
Job Title: IC Package Design Engineer

At Apple, we're looking for a skilled IC Package Design Engineer to join our Hardware Technology Packaging team. As a key member of our team, you'll be responsible for designing and developing electronic packaging solutions for our consumer electronic products.

Key Responsibilities:
  • Design and develop package structures and configurations for SoC, Memory, RF, and cellular chips.
  • Define and develop design verification and automation strategies to strengthen and streamline package design and release flows.
  • Drive methodology, innovations, and efficiency improvements in package design with vendors and developers.
  • Interface and coordinate with cross-functional groups throughout Apple on new product package/SiP/module feasibility analysis, design, and selection.
  • Ensure package design is optimized with SI/PI requirements.
  • Explore, evaluate, and develop new CAD tools, design, and verification flows.
  • Collaborate in multi-functional discussions for package architecture and technology roadmap.
  • Identify and drive cost-saving opportunities and/or performance-enhancing features.
  • Perform extraction of S-parameters and package RLGC models.
Requirements:
  • Hands-on experience with package design and proficiency in Cadence Allegro platform tools or Mentor Xpedition platform tools.
  • Solid fundamentals in electrical/material/thermal/mechanical engineering fields.
  • Familiarity with various sophisticated package configurations and assembly/substrate technology.
  • SI/PI tools, package model extraction, S-parameters, and RLGC models.
  • Substrate manufacturing process, structure, design rules, and material properties.
  • Solid understanding of high-speed interfaces, including DDR, PCIe, NAND, etc.
  • Exposure to Unix environment, scripting languages, and methodology.
Preferred Experience:
  • Familiarity with package design reviews and familiarity with CAM350/Valor or Calibre and CAD.
  • Knowledge of high-speed layout constraints, crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance.
  • Design experience with RFIC and 5G packages, SIP or module schematic and layout design.
  • Hands-on knowledge of Design Rules Check and Design for Manufacturing.
  • Experience with TSV, 2D/2.5D, and 3D package connections.
  • Familiarity with Cadence Concept HDL for schematic review, experience in schematic capture, and system integration.
Education & Experience:
  • BS and 10+ years of relevant industry experience.
Additional Requirements:
  • Pay & Benefits: At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $166,600 and $296,300, and your base pay will depend on your skills, qualifications, experience, and employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs.
  • Benefits: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition.

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