Microelectronics Design Engineer
1 month ago
The EW Division of Leidos is seeking a highly skilled Microelectronics Design Engineer to join our multi-disciplined design team. As a key member of our team, you will be responsible for designing, developing, simulating, and integrating innovative custom microelectronics in support of warfighter missions.
Key Responsibilities:- Support technical and programmatic assessments of technologies, capabilities, materials, equipment, and performers in support of the advancement of the U.S. Defense Industrial Base's (DIB) access to trusted, state-of-the-art microelectronics.
- Interface and collaborate with a range of engineers, scientists, policy makers, and executives within the government, industry, and academia across the country.
- Provide occasional technical support and/or field support planning, and other field support in general if needed.
- Conduct experimental tests on latest SoC evaluation boards, evaluate results, and then develop specifications for selecting next-generation components for deliverable systems.
- Interact with outside customers, suppliers, and functional peer groups.
- Some travel and work at remote sites for limited time periods may be occasionally required.
- Provide status reports to project managers and/or division production manager as required.
- U.S. Citizenship with the ability to obtain a TS clearance.
- BS and 8 years required. Masters Degree in Electrical Engineering, Computer Engineering, Computer Science or related technical discipline desired with 6+ years of experience.
- Experience with DSP fundamentals and FPGA implementation.
- Experience with Matlab/Simulink.
- Experience with microchip EDA tools and flows (Synopsys, Cadence, etc.).
- Microelectronics hardware subject matter expertise in at least (1) of the areas listed below AND experience in (1) additional area listed below:
- Microelectronics Supply Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction).
- Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.).
- Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability).
- Hardware Programming: FPGA (i.e. Verilog, VHDL), Programming (Linux command line/scripting, Python, Java, and C++).
- 8+ years experience in leading a design team.
- Experience in hardware test and measurement and hands-on lab debug.
- Experience with interfaces: ADC/DACs, SerDes, PCIe, JTAG, DDRx.
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