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Advanced Packaging Engineer
2 months ago
Position: Advanced Packaging Engineer
Location: Orlando, Florida
Compensation: Dependent on Experience
Are you enthusiastic about pioneering technology and semiconductor packaging? We are looking for a skilled engineer to enhance our innovative team. With a legacy of excellence, we are dedicated to advancing technology and developing exceptional solutions.
Your Role: RF Component Design As a key contributor, you will be responsible for the design and simulation of RF/mw/mmw transceiver components. Picture yourself assembling a collection of electronic elements, each contributing its unique capabilities. Your goal? Ensure the integrity of high-speed signal transmission.
Key Responsibilities:
- Establish advanced packaging specifications.
- Identify and validate cutting-edge packaging technologies, materials, and assembly processes.
- Design integrated circuit packages and oversee their assembly.
- Conduct reliability assessments and failure investigations.
- Assist in production scaling and process enhancement.
- Coordinate with subcontractors and oversee external suppliers.
- Collaborate with foundries and OSATs to transition packaging concepts into mass production.
- Experience with RF packaging is advantageous.
Qualifications:
- Master's degree in Engineering, specializing in electronics or microelectronics.
- A minimum of 5 years of experience in advanced integrated circuit packaging.
- Strong interpersonal skills and ability to build business relationships.
- Comprehensive understanding of packaging technologies, assembly methods, IC materials, reliability criteria, and failure analysis practices.
- Professional experience in project management with global partners.
- Familiarity with software tools such as CST Studio Suite, Ansys HFSS, Ansys Q3D, Ansys SIwave, and Cadence Sigirty is a plus.
Next Steps: If you possess the expertise and dedication to drive excellence in RF technology, we encourage you to submit your application and resume for consideration.
