Senior Package Design Engineer

4 days ago

Santa Clara, California, United States Astera Labs Full time
Job Description

Astera Labs is a global leader in purpose-built connectivity solutions that unlock the full potential of AI and cloud infrastructure. Our Intelligent Connectivity Platform integrates PCIe, CXL, and Ethernet semiconductor-based solutions and the COSMOS software suite of system management and optimization tools to deliver a software-defined architecture that is both scalable and customizable.

Inspired by trusted relationships with hyperscalers and the data center ecosystem, we are an innovation leader delivering products that are flexible and interoperable. Discover how we are transforming modern data-driven applications.

Job Responsibilities
  • Design packages substrate independently from definition to package tape-out, working on provided netlist and specification, through performance optimization, design for manufacturing, sign-off verification, etc.
  • Work in a cross-functional environment with SI/PI team, package program management, product engineering/test, hardware engineering, etc.
  • Design and layout a FCBGA/FCCSP package from start to tape-out independently.
  • Experience in large FCBGA/FCCSP package design in high-speed SoC is highly desired.
  • Familiar with BGA package substrate technologies and assembly process.
  • Good understanding of BOM, stackups, high-speed design rules and guidelines.
  • Working knowledge of package reliability, SI/PI, etc.
Requirements
  • Proficiency in Cadence APD/SiP is a must.
  • Able to design large body BGAs from concept to tape out.
  • Good understanding of BGA package BOM and integration into APD layout and routing design rules.
  • Setup layer-stackup, padstacks, design constraints (physical and electrical), SMT components, optimize design based on SI/PI simulation result and design reviews.
  • Understanding of transmission line theory and SI/PI fundamentals is a plus.
  • Conduct DRC/DRV/LVS/DFM checks with given tools, perform design review reporting, and Gerber and artwork releasing.
  • Generate all required package design documentations.
  • Perform feasibility studies such as fan-out, mockup design, layer & package size reduction, etc.
  • Basic knowledge of packages manufacturing flow, supply chain, reliability, risk management and failure analysis.
  • Drive new design flow development in APD with given new package types or technologies.
  • Drive methodology and productivity improvements in package design by working with vendors or scripting.
Preferred Qualifications
  • Multi-chip, interposer, 2.5D or heterogeneous package design experience is a plus.
  • Proficiency in scripting languages for design and reporting automation is a plus.

The base salary range is $130,000.00 USD - $185,000.00 USD. Your base salary will be determined based on your location, experience, and the pay of employees in similar positions.

We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.

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